Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
Industry Directory | Manufacturer
UV & Thermal Cure Epoxies for Adhesives, Coatings & Sealants
New Equipment | Curing Equipment
The mini vertical oven has a cycle time of 25 - 60 seconds per 150mm fixture, 4mm Edge Hold Pins and Guides. PCBs up to 250mm wide can be processed. Dual Feed option for high throughoutput. In-line, vertical automation of the epoxy cure process prod
New Equipment | Curing Equipment
Heller 788 In-line, Continuous Cure, Vertical Format Oven This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Electronics Forum | Sat Jul 17 01:23:29 EDT 1999 | Scott McKee
| | | | I need a good chemical to remove the lacquer finish off of magnet wire. I know there are different kinds but I need one that really works. Any suggestions would be great. thanks in advance guys. | | | | | | | What is it you're trying to do?
Electronics Forum | Sat Jul 17 03:02:58 EDT 1999 | Jeff Sanchez
| | | | | I need a good chemical to remove the lacquer finish off of magnet wire. I know there are different kinds but I need one that really works. Any suggestions would be great. thanks in advance guys. | | | | | | | | | What is it you're trying t
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment
Used SMT Equipment | SMT Equipment
Product Name:Panasoinc high speed chip mounter NPM Product number: NPM1 Detailed product introduction NPM multifunction machine, SMT machine, machine with function function function, check the dispensing machine, is a multifunctional equipment
Industry News | 2003-04-02 09:01:24.0
Turnover a little lower than that of 2001/02 is projected for the whole financial year
Industry News | 2003-02-27 09:01:39.0
U.S. companies are beginning to wake up to the lead-free electronics production movement, which was pioneered in Japan and taken up by European manufacturers.
Parts & Supplies | Screen Printers
Name: P0989; MPMAP class machine camera XY limit switch Part Number: P0989; SENSOR, PROXIMITY Description: P0989; SENSOR, PROXIMITY; MPM AP class machine camera XY limit switch Applicable models: AP Printing Presses P0989; SENSOR, PROXIMITY
Parts & Supplies | SMT Equipment
MPMAP class machine camera XY limit switch Name: P0989; MPMAP class machine camera XY limit switch Part Number: P0989; SENSOR, PROXIMITY Description: P0989; SENSOR, PROXIMITY; MPM AP class machine camera XY limit switch Applicable models: AP Pri
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
Increase productivity, improve quality, reduce costs with vertical format curing solutions from Heller Industries. Learn more: http://www.hellerindustries.com/755-Vertical-Oven.php
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Tue Oct 11 00:00:00 EDT 2022 - Tue Oct 11 00:00:00 EDT 2022 | Salt Lake City, Utah USA
Utah Expo & Tech Forum
Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,
SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial
Career Center | Houston, Texas USA | Engineering
REQUIRES: 3 plus years in test engineering using digital test equipment {ATE} testing integrated circuits. Prefer candidate with experience testing microprocessor products to the component level. Candidate must be able to write test programs and debu
Career Center | Dallas, Texas USA | Engineering
Requirements: 3 plus years experience using RF Test Equipment {ATE} Testing frequencies ranging from 900 mhz-3 ghz, prefer experience to 6 ghz instrumentation. "Blue Tooth" cellular phones are the products being tested. Must be able to write test pro
Career Center | Danville, California | Sales/Marketing
Robert Riemer 129 Wilshire Ct. Danville, CA. 94526 (925) 820-6545 Home (925) 820-6546 Fax (925) 548-9633 Cell briemer@pacbell.net OBJECTIVE Seeking a challenging sales position with a dynamic company pursuing rapid, consistent growth in the electro
Career Center | RACINE, Wisconsin USA | Sales/Marketing
Business Development Leader • Experienced business leader in-depth knowledge in techincal industries, candid communicator. • Expertise in building and expanding client base, increasing name recognition and market share using a wide array of tools,
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/2632220023-little-exhaust-blower-fan-cy076-for-jt-se-350-ii-221880?page=75&order=list_price+asc
Little exhaust blower fan,CY076 For JT SE-350-II | Qinyi Electronics Co.,Ltd × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products Little exhaust blower fan,CY076 For JT SE-350-II Public
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_wave_solder_ersa1.html
. Fingers are in like new condition and the inside is Super Clean!!! Great opportunity for someone who wants to do a little work. This machine has some dents in the panels, needs front and back covers, and a monitor
