Technical Library | 2010-11-04 19:56:25.0
Conductive Adhesives represent an intrinsically clean, simple and logical solution for a myriad of electrical interconnect challenges. Adhesives not only provide a "lead-free", "no clean" alternative to solder, these highly compatible materials offer viab
Technical Library | 2015-01-28 17:39:34.0
Stacking heterogeneous semiconductor die (memory and logic) within the same package outline can be considered for less complex applications but combining the memory and processor functions in a single package has compromised test efficiency and overall package assembly yield. Separation and packaging the semiconductor functions into sections, on the other hand, has proved to be more efficient and, even though two interposers are required, more economical. The separated logic and memory sections are configured with the same uniform outline for vertical stacking (package-on-package). The most common configuration places the logic section as the base with second tier memory section soldered to a mating contact pattern. This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology.
Technical Library | 2012-06-01 00:14:04.0
PLCs are the brains of your operation. When the PLC (Programmable Logic Controllers) is not functioning properly, lines shut down, plants shutdown, even city bridges and water stations could cease to operate. Thousands to millions could be lost by one li
Technical Library | 2013-04-03 22:41:18.0
PLC vs PAC Difference & PAC Automation Controller Defined: This PLC vs PAC Difference article defines the PAC automation controller in relationship to the PLC. A PLC vs PAC comparison. Even more importantly, this article explains in great detail the need to differentiate when it comes to requesting and delivering PAC and/or PLC training.
Technical Library | 2012-01-26 20:28:34.0
In electronics design, Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet, a part has a third view, which CAD tools ignore – its supply data (Manufacturer part num
Technical Library | 2021-12-28 01:34:06.0
PLC (Programmable Logic Controller) and VFD (Variable Frequency Drive) play an important role in industrial production and technological development. They have been widely used in the field of industrial automation and mechanical automation. The control of the PLC and VFD is quite intelligent and automated, which brings great convenience to industrial production and life. The PLC and VFD will perform intelligent calculation, control and output according to the predetermined program. Today we will focus on how the PLC and the VFD communicate, and in what ways? First, let's take a look at their respective basic structures.
Technical Library | 2022-01-19 17:25:29.0
Electrochemical sensors are a class of sensors in which the transducer component is the electrode. These methods are presently utilized in a wide assortment of business applications. These sensors are significant for some factors: the utilization of the electron for signal obtaining, which is known to be a perfect model for logical applications, without squander age; scaling down in versatile gadgets (test microvolume investigation); quick examination; and minimal effort of creation, permitting these techniques to be promoted (for example as business glucose sensors).
Technical Library | 1999-05-07 10:18:34.0
A novel programmable element has been developed and evaluated for state of the art CMOS processes. This element is based on agglomeration of tVarious aspects of these programmable devices including characterization and optimization of physical and electrical aspects of the element, programming yield, and reliability have been studied. Development ofhe Ti-silicide layer on top of poly fuses.
Technical Library | 2017-03-02 18:13:05.0
The need for more energy-efficient solid-state switches beyond complementary metal-oxide-semiconductor (CMOS) transistors has become a major concern as the power consumption of electronic integrated circuits (ICs) steadily increases with technology scaling. Nano-Electro-Mechanical (NEM) relays control current flow by nanometer-scale motion to make or break physical contact between electrodes, and offer advantages over transistors for low-power digital logic applications: virtually zero leakage current for negligible static power consumption; the ability to operate with very small voltage signals for low dynamic power consumption; and robustness against harsh environments such as extreme temperatures. Therefore, NEM logic switches (relays) have been investigated by several research groups during the past decade. Circuit simulations calibrated to experimental data indicate that scaled relay technology can overcome the energy-efficiency limit of CMOS technology. This paper reviews recent progress toward this goal, providing an overview of the different relay designs and experimental results achieved by various research groups, as well as of relay-based IC design principles. Remaining challenges for realizing the promise of nano-mechanical computing, and ongoing efforts to address these, are discussed.
Technical Library | 2010-06-30 17:43:04.0
As silicon technology advances to enable higher density ASICs, the core logic voltage decreases. The lower voltage, in combination with higher current requirements, requires tighter tolerances on the power supplies. The control of the power supplies from the PCB to the die is the subject of this study. A frequency sweep simulation using typical bypass values shows that a discrete package capacitor is not a significant factor in reducing the chip core power supply fluctuation. A small voltage boost at the PCB supply can provide a more economical solution to managing the device supplies.
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