Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Industry News | 2015-03-03 12:58:47.0
In recognition of their significant contributions of time, talent and ongoing leadership in IPC and the electronics industry, three long-time IPC volunteers were presented with IPC President's Awards at IPC APEX EXPO® at the San Diego Convention Center in San Diego, Calif. The award recipients were: Kathy Johnston, Raytheon Missile Systems; Steve Martell, Sonoscan, Inc.; and Lee Wilmot, of TTM Technologies, Inc.
Industry News | 2022-05-18 12:46:50.0
Committee Awards presented at IPC SummerCom 2022
SMTnet Express, August 6, 2015, Subscribers: 23,145, Members: Companies: 14,536, Users: 38,702 Enclosed Media Printing as an Alternative to Metal Blades Michael L. Martel; Speedline Technologies, Inc. Fine pitch/fine feature solder paste printing
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