ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/seminars
About Us Sonoscan Leadership Company History Locations Patent List News Events Careers Nordson SONOSCAN Home Support Seminars Seminars Microscopic voids, cracks and delaminations can escape
| https://www.eptac.com/wp-content/uploads/eptac/schedules/2020/EPTAC_TrainingSchedule_Counterfeit.pdf
the visual detection of counterfeit and substandard characteristics through a hands-on workshop. A unique opportunity to examine real components with live, on-site microscopic magnification to obtain experience in the visual inspection tech- niques of IDEA-STD-1010 and learn how to detect
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/materials
. This is an original method to characterize solder fatigue properties on a microscopic level. Micro Fracture of Glass Composites Using Hot Probe Attach App Note The hot bump pull cartridge is unique technology to DAGE and allows individual pads to be pulled from circuit boards
| https://www.eptac.com/class/counterfeit-components-workshop
and substandard characteristics, through a hands-on workshop. The training environment provides a unique opportunity to examine real components with live, on-site microscopic magnification to obtain experience in the visual inspection techniques of IDEA-STD
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/x-ray-inspection
. µCT Computed Tomography Create 3D models and image slices of your sample at high resolution. µCT allows you to unambiguously examine microscopic features and defects with confidence, perfect for failure analysis applications
| https://www.eptac.com/class/counterfeit-components-workshop/
characteristics, through a hands-on workshop. The training environment provides a unique opportunity to examine real components with live, on-site microscopic magnification to obtain experience in the visual inspection techniques of IDEA-STD
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Humidity – Moisture has increasingly become one of the biggest issues for printed circuit board manufacturers today. Aside from the popcorn effect and microscopic cracking, it can also cause solder balls to form due to escaping air or water
ASCEN Technology | https://www.ascen.ltd/Blog/machine/Conformal_coating_machine/997.html
static.It can be full panel coating or selective coating.This PCB coating equipment eliminates the microscopic bubbles,common in other sealant applications,and provides a superior moisture barrier
| https://www.eptac.com/blog/what-materials-will-replace-silicon-in-future-tech
. But what can these microscopic materials accomplish? These materials will include novel features such as infrared night-vision mode in smartphones or microchips that are 10 times faster and more power-efficient
| https://www.eptac.com/what-materials-will-replace-silicon-in-future-tech/
. But what can these microscopic materials accomplish? These materials will include novel features such as infrared night-vision mode in smartphones or microchips that are 10 times faster and more power-efficient
