Industry News | 2013-06-10 17:08:51.0
GPD Global will exhibit in Stand #6275 in the North Hall at the 2013 SEMICON West exhibition & conference. Representatives from GPD Global will exhibit the company's new technology related to fine line and nano-shot dispensing, particularly related to vertical interconnect technology.
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Industry News | 2018-12-08 03:38:44.0
Lead-Free (Pb-Free) Solder and Composition
Industry News | 2010-12-01 14:28:16.0
With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.
Industry News | 2016-01-17 19:26:58.0
In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.
Industry News | 2018-10-18 07:56:58.0
Wave soldering process defectives and handling solution
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2018-10-18 10:43:28.0
Suggested 14 and 16 Layer Board Layouts
Industry News | 2020-06-24 15:45:07.0
IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.
Industry News | 2019-12-09 16:03:06.0
Growth is slowing worldwide and the industry’s outlook is less optimistic than in previous quarters, although it is still generally positive, according to the results of IPC’s fourth-quarter 2019 Pulse of the Electronics Industry survey. Based on responses from 82 companies that make up a representative sample of the industry, global third-quarter 2019 sales growth, averaging 3.0 percent, was at its lowest level since the quarterly survey began in mid-2017. The sales growth the respondents predicted for the current quarter is down further, averaging 2.6 percent.
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