Electronics Forum | Mon Nov 01 21:50:32 EST 1999 | chartrain
No clean flux is really a misnomer. What is often taken to mean no residue in effect means no visible residue. Because you can't see it doesn't mean it isn't here. Many manufacturers have been through this same learning curve. The goal with a no clea
Electronics Forum | Wed Apr 27 20:55:10 EDT 2005 | KEN
One thing that may have been over looked: Not all solder pastes are created equal. Period. The best way to avoid these situations is to characterize you material (and your process). The fact is you could try every aperture shape under the sun....a
Electronics Forum | Wed Apr 27 01:20:22 EDT 2005 | Frank
Are you sure about your dimensions? .45mil ball diameter and .8mil pitch, and a body size of 16x8mils is really, really tiny. I assume you mean millimeters and not mils? 1mil = 0.0254millimeters If your stencil is 5mils and your ball diameter is
Electronics Forum | Fri Oct 09 23:17:05 EDT 1998 | kallol Chakraborty
| | I need to set a cleanliness limit for our incoming boards. I know that some people use 14-10 microgr. sq. in. But how can I determine what is best for me. | | Can anybody tell me if there's a standard for this. | | Right now we are using an Alph
Electronics Forum | Sun Feb 28 20:05:54 EST 2010 | aungthura
Dear all There are alot sockets in our products,BIB.These skts are lifted abit after being solderd with wave machine.If the skts become lifted, how much tolerance of the high is acceptable? as example 1mil~5mil,or,1mil~8mil. Pls advise me. Thanks in
Electronics Forum | Thu Nov 04 15:57:46 EST 1999 | Dave F
I'm with John. Back in the old MIL-2000 days, the pot temperature was 245-275C (475-525F). Now, 240-260C (460-480 F) is more accepted for eutechic (eutechicish) solder. My2� Dave F
Electronics Forum | Thu Jan 08 15:03:40 EST 2004 | dwzeek
We have an ongoing problem with our QFP144 packages soldering. It has not received much attention until late due to some customer failures. Most of the failures would show up in ESS testing and be repaired. The failure rate is about 2 in 1000 parts f
Electronics Forum | Mon Aug 30 10:17:16 EDT 2010 | markgray
We currently use this devise in one of our designs with no issues. We are using a 3mil stencil and a 45% apperature reduction. It is virtually impossible to eliminate voids but they are in an acceptable range. Solder balls are caused on this componen
Electronics Forum | Fri Oct 27 10:35:36 EDT 2000 | Chris
We are having problems soldering this motorola part(XPC860TZP50B5). After reflow, some of the balls appear to be sitting on the reflowed paste rather than wetted to it. We reviewed parts and found oxidation on many. We have four other BGA's, from oth
Electronics Forum | Wed May 26 06:54:07 EDT 2004 | davef
Q1) if this is an acceptable component-lead modification? A1) Yes, it's acceptable Q2) and does this mod meet any existing IPC specs?(did a internet search but no result) Q2) IPC repair guidelines are: 7711A/7721A - Rework and Repair Guide For ot
