The MK-838 is used for efficient and flexible high yield wafer bumping as well as hybrid applications. Shown with Pressure Chamber for superior paste release and automatic substrate handling.
Minami�s Rotary Squeegee is a high precision print head with enclosed print material (solder, adhesive, etc.) allotted from inexpensive laminated plastic bags. It applies the �paste rolling formula�. Real time paste monitoring ensures the optimum amo
Lead-Free Solder Wafer Bumping Lead-Free Solder Wafer Bumping Over the past 30 years we have learned that lead has negative affects on the health of humans and seen strong legislation remove it from gasoline and paints. More recently, governments
