2 minami mk-838sv wafer solder bump results

New SMT Equipment: minami mk-838sv wafer solder bump (Page 1 of 1)

MK-838sv

MK-838sv

New Equipment |  

The MK-838 is used for efficient and flexible high yield wafer bumping as well as hybrid applications. Shown with Pressure Chamber for superior paste release and automatic substrate handling.

MINAMI AMERICA INC.

Rotary Squeegee Print Head

Rotary Squeegee Print Head

New Equipment |  

Minami�s Rotary Squeegee is a high precision print head with enclosed print material (solder, adhesive, etc.) allotted from inexpensive laminated plastic bags. It applies the �paste rolling formula�. Real time paste monitoring ensures the optimum amo

MINAMI AMERICA INC.

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