New SMT Equipment: mirtec false call offset (2)

SHS60 - 3D in-line SPI System

SHS60 - 3D in-line SPI System

New Equipment | Inspection

3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys

Hanwha Techwin CO., LTD.

SPI HS60 - 3D Solder Paste Inspection System

SPI HS60 - 3D Solder Paste Inspection System

New Equipment | Inspection

The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate

PARMI

Electronics Forum: mirtec false call offset (41)

YesTech F1 AOI false calls and misses

Electronics Forum | Thu Apr 19 20:01:30 EDT 2012 | eadthem

some things to consider, Is there flux on the board. are there finger prints on the tops of parts. Is the board warped at the V score from reflow Is the board shifting in the machine during inspection. These are the issues we have had with our mir

FALSE CALL REDUCTION

Electronics Forum | Wed Aug 07 17:05:41 EDT 2024 | pradeep14

We are a high mix low or middle volume production. We are using 3D AOI MIRTEC. How to reduce the false cals. Every batch we are adding more samples to the program but we can't able to reduce the false call ratings. Suggest how to control the FALSE ca

Used SMT Equipment: mirtec false call offset (4)

JUKI KE 2070L

JUKI KE 2070L

Used SMT Equipment | Pick and Place/Feeders

  Dear Customer,   We have the machine as below for sales,   Model: KE 2070 L   Vintage: 2010   No Feeder   Please contact us if you are interested.   Regards   Michael     var LEO_HIGHLIGHTS_INFINITE_

Neko Automation (S) Pte Ltd

JUKI KE 2080L

JUKI KE 2080L

Used SMT Equipment | Pick and Place/Feeders

  Dear Customer,   We have the following machine for sales,   Model: KE 2080 L   Vintage: 2010   No Feeder   C/W Tray unit   Please contact us if you are interested.   Regards   Michael     var LEO

Neko Automation (S) Pte Ltd

Industry News: mirtec false call offset (14)

National Circuit Assembly Offers Authentic Measurement and Inspection with New 3D SPI System

Industry News | 2020-09-22 11:05:29.0

National Circuit Assembly has purchased and installed a PARMI HS60L 3D Solder Paste Inspection (SPI) system. With the most reliable and accurate 3D data, NCA offers reliable, accurate inspection.

National Circuit Assembly

3-D solder paste inspection with Process Uplink function: More than just defect detection

Industry News | 2012-04-06 19:44:17.0

In SMT electronic assembly production, 3-D SPI has established itself as the additional inspection gate to complement optical or X-ray inspection.

Viscom AG

Express Newsletter: mirtec false call offset (707)

Partner Websites: mirtec false call offset (15)


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