Industry News | 2019-04-30 17:39:40.0
The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2018-10-15 18:42:06.0
Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany. At the conference, Karch will deliver his presentation entitled New Solder Alloy with Extended Temperature Range for High-Reliability Applications. He will review test results that demonstrate how a new alloy excels in harsh environments, including wide temperature range and high CTE mismatch. Karch will also share data from existing application qualifications.
Industry News | 2015-09-06 18:57:07.0
CyberOptics® Corporation (NASDAQ: CYBE) today announced that Senior Image Processing Research Engineer John Hoffman, PhD will present during the technical session ‘Advances in Process Controls, From 3D Printing to 3D Inspection to Measuring Thermal Expansion Mismatch’, scheduled to take place Wednesday, September 30, 2015 from 2-3:30 p.m. at SMTA International in Rosemont, IL.
Industry News | 2019-05-16 01:22:31.0
Many Cusromers inquiry Headpcb's capabilty of counter sink board, and they are easy to mismatch counter sink with counterbore. In fact, there have big difference between counter sink and counterbore, today Headpcb's senior RD engineer Macros Zhang spare an article about counter sink and counterbore, hope this will help you having a better understanding about them.
Industry News | 2007-12-11 15:07:32.0
Agilent Technologies Inc. (NYSE: A) today announced the availability of a new Gain Compression Application (GCA) for its premier-performance PNA-X network analyzer.
Industry News | 2012-06-01 09:09:55.0
Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect.
Industry News | 2019-03-12 08:54:28.0
(Albany, NY) March 12, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA. Additionally, Dr. Wusheng Yin, President of YINCAE, will be giving a presentation on our unique product, Zero Outgassing and Flux Residue-compatible Underfill.
