Industry News: mismatch (Page 1 of 2)

SMTA Capital Chapter Tutorial – Supporting High Reliability at the OEM: A PCB Perspective

Industry News | 2019-04-30 17:39:40.0

The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor an amazing Chapter Tutorial Program. The tutorial will be held on June 11 and showcase the latest technologies, designs and reliability trends.

Surface Mount Technology Association (SMTA)

Indium Corporation Expert to Present at IMAPS Autumn Conference in Munich

Industry News | 2018-10-15 18:42:06.0

Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany. At the conference, Karch will deliver his presentation entitled New Solder Alloy with Extended Temperature Range for High-Reliability Applications. He will review test results that demonstrate how a new alloy excels in harsh environments, including wide temperature range and high CTE mismatch. Karch will also share data from existing application qualifications.

Indium Corporation

CheckSum to Show Parallel Functional Test for Panels of Small Boards at APEX

Industry News | 2020-01-07 11:43:36.0

CheckSum today announced plans to exhibit at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The team will showcase its new Parallel Functional Test in Booth #3445.

CheckSum Llc

CyberOptics’ John Hoffman, PhD to Present during Technical Session at SMTAI 2015

Industry News | 2015-09-06 18:57:07.0

CyberOptics® Corporation (NASDAQ: CYBE) today announced that Senior Image Processing Research Engineer John Hoffman, PhD will present during the technical session ‘Advances in Process Controls, From 3D Printing to 3D Inspection to Measuring Thermal Expansion Mismatch’, scheduled to take place Wednesday, September 30, 2015 from 2-3:30 p.m. at SMTA International in Rosemont, IL.

CyberOptics Corporation

COUNTER SINK VS COUNTERBORE

Industry News | 2019-05-16 01:22:31.0

Many Cusromers inquiry Headpcb's capabilty of counter sink board, and they are easy to mismatch counter sink with counterbore. In fact, there have big difference between counter sink and counterbore, today Headpcb's senior RD engineer Macros Zhang spare an article about counter sink and counterbore, hope this will help you having a better understanding about them.

Headpcb

Agilent Technologies' New Gain Compression Application Optimizes Accuracy, Speed of Amplifier Test

Industry News | 2007-12-11 15:07:32.0

Agilent Technologies Inc. (NYSE: A) today announced the availability of a new Gain Compression Application (GCA) for its premier-performance PNA-X network analyzer.

Agilent Technologies, Inc.

Practical Components Helps Diagnose and Treat Head-in-Pillow Failure PBGA 928-HiP — A large component with a single small die is a recipe for HiP failure

Industry News | 2012-06-01 09:09:55.0

Head-in-Pillow (HiP) soldering defects are common with modern SMT component placement. As a result, Practical Components has introduced the PBGA 928-HiP, a component that is designed specifically to be susceptible to HiP defects. It features a large 4x4 body size, 928 balls and a single small die that has a propensity toward the ball-in-socket HiP soldering defect.

Practical Components, Inc.

YINCAE Advanced Materials to Exhibit and Present at IMAPS New England Symposium & Expo 2019

Industry News | 2019-03-12 08:54:28.0

(Albany, NY) March 12, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA. Additionally, Dr. Wusheng Yin, President of YINCAE, will be giving a presentation on our unique product, Zero Outgassing and Flux Residue-compatible Underfill.

YINCAE Advanced Materials, LLC.

Multitest's Günther Jeserer to Present at SEMICON West 2010

Industry News | 2010-06-23 12:15:55.0

Rosenheim, Germany — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Günther Jeserer, Business Unit Manager, will present a paper titled “Improved Cost of Test by Optimized Tester Utilization” at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

Multitest Elektronische Systeme GmbH

IMAPS New England Symposium & Expo 2019 is just 4 weeks away! Visit YINCAE on May 7, 2019

Industry News | 2019-04-10 10:19:18.0

(Albany, NY) April 8, 2019 IMAPS New England Symposium & Expo 2019, will be held at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA on May 7, 2019. YINCAE Advanced Materials hopes you will stop by our booth to learn more about YINCAE and the innovative products we have to offer: Solder Joint Encapsulants, Underfill Materials, Die Attach Adhesives, Thermal Interface Materials and more.

YINCAE Advanced Materials, LLC.

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