Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and
Oak-Mitsui has developed a novel thin substrate, FaradFlex�, which is the next generation of Buried Capacitance material. Buried Capacitance utilizes the technology of putting a capacitor plane inside the PCB to reduce the overall impedance of the po
Aluminum Bonded Copper or �ABC� represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC�s product technology. Critical m
Designers and fabricators are always arguing about how to reduce track width and increase reliability of the circuitry. One effective solution is MicroThin�. MicroThin� is a very low profile copper 3�m or 5�m copper foil with an 18�m or 35�m peelable
New Equipment | Industrial Automation
Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Skype: onlywnn_1 Wechat : mooreplc website : www.salesplc.com
New Equipment | Industrial Automation
Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Skype: onlywnn_1 Wechat : mooreplc website : www.salesplc.com
New Equipment | Industrial Automation
Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Skype: onlywnn_1 Wechat : mooreplc website : www.salesplc.com
New Equipment | Industrial Automation
Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Skype: onlywnn_1 Wechat : mooreplc website : www.salesplc.com
New Equipment | Industrial Automation
Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Skype: onlywnn_1 Wechat : mooreplc website : www.salesplc.com
New Equipment | Industrial Automation
Contact :Sandy Lin Email: unity@mvme.cn Mob/Whatsapp :+ 86 18020776786 Skype: onlywnn_1 Wechat : mooreplc website : www.salesplc.com
