Motorola Mobility makes Android smartphones and Bluetooth accessories to keep people connected.
Industry Directory | Consultant / Service Provider / Manufacturer
Delkin Devices, Inc. is an independently owned business and the largest US memory card manufacturer in San Diego, CA.
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
New Equipment | Test Equipment
QYSMT MOREL PMP-500 First Article Inspection Tester PMP-500 First Article Inspection Tester is mainly used for the first article inspection of the SMT production process in electronics factories. The operation of the tester for the first unit of PC
Electronics Forum | Tue Aug 06 23:17:24 EDT 2019 | zeepower
The Optimized Wireless Charging Product, a new powerful wireless charger that can be hidden under your desktop and charge your mobile devices directly through your desktop. ZeePower GK35001—— Its input is 19V / 2A, supporting a space charging distan
Electronics Forum | Sun Jun 05 13:42:16 EDT 2005 | amigo
We find it impossible to remove the glued micro-BGA chips like the CPU and the UEM ICs used in Mobile Phones. They are both surface mount devices and glued with some chemicals we think. Any help is most needed in this matter.
Used SMT Equipment | Pick and Place/Feeders
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Used SMT Equipment | Pick and Place/Feeders
Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num
Industry News | 2003-03-12 09:03:48.0
Demand for the material, used in PCBs, is increasing because of folding mobile phones and other devices
Industry News | 2020-04-02 14:42:58.0
Due to the ongoing COVID-19 pandemic, Blackfox is offering online IPC training and certification beginning in mid-April.
Parts & Supplies | Pick and Place/Feeders
YAMAHA CL 8X2 device (0201) YAMAHA CL feeder series YAMAHA CL feeder Part Number: Yamaha CL 8 * 2 mm feeder 0201 KW1-M1500-030 Yamaha CL 8 th * 2 mm-M1400-00X KWl feeder 0402 . 8 Article Yamaha CL * 4 mm feeder KW1-M1100-000 Yamaha CL12
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Parts & Supplies | Pick and Place/Feeders
YAMAHA CL 8X2 device (0402) YAMAHA CL feeder series YAMAHA CL feeder Part Number: Yamaha CL 8 * 2 mm feeder 0201 KW1-M1500-030 Yamaha CL 8 th * 2 mm-M1400-00X KWl feeder 0402 . 8 Article Yamaha CL * 4 mm feeder KW1-M1100-000 Yamaha CL12 m
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2009-01-21 23:01:49.0
Over the last 10 years, the adoption of wafer-level packaging (WLP) has expanded to a wide range of semiconductor devices applied in a crosssection of industries from Automotive to Mobile Phone, Sensors to Medical Technology.
The SC-350 is specifically optimized to atomize coating fluids – delivering exceptional edge definition. For more information, please visit our product page - http://www.nordson.com/en/divisions/asymtek/products/applicators/select-coat-applicator-se
PCB Depaneling Router ML-CS818 This device is suitable for various small multi-connected PCB sub-boards such as mobile phones, tablet computers, automotive electronics, GPS, boards, etc. The enlarged size is suitable for the sub-board processing of
Training Courses | ONLINE | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Events Calendar | Tue May 12 00:00:00 EDT 2020 - Tue May 12 00:00:00 EDT 2020 | ,
12 Essential Skills Every Engineer Needs To Learn Part 1
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
Career Center | San Jose, California USA | Engineering,Technical Support
Attention 2-4 year tech school/engineering graduates with a willingness to learn and travel! We are looking for a field service engineer based in Phoenix, LA or San Jose area that will be responsible for installing, servicing and training customers o
Career Center | Rochester, New York USA | Engineering
Kodak ISS continues to experience significant growth. As part of Kodak's digital growth strategy, ISS develops, manufactures and markets imaging sensor devices that are a critical component in a broad range of imaging products including digital camer
Career Center | RANCHI, JHARKHAND India | Engineering
(1)-TECHNICAL SKILLS • SURFACE MOUNT TECHNOLOGY for PCB assembly • Cellular Mobile Communication • Mobile switching • Electronics device and circuits. • PCB card testing (2)-TRAINING SKILLS- (A) Six months industrial training at Indian Telephon
Career Center | Muzzaffarnagar, India | Production
Complete programming of Pick & Place as per BOM. Working with both low & high Profile solder Paste, and Glue. Accurate Placement of all SMT Component like Chip, SOT, SOD, QFP, Tantalum Capacitor & etc. Familiar with the critical problem in process
KingFei SMT Tech | http://www.smtspare-parts.com/sale-8493221-00328504s02-latching-device-assy-used-for-siemens-24-32mm-feeder.html
00328504S02 Latching Device Assy Used For Siemens 24/32mm Feeder Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| https://www.feedersupplier.com/sale-13119472-dek-smt-spare-part-157679-dek-extrusion-assembly-alcohol-device.html
DEK SMT spare part 157679 DEK Extrusion Assembly Alcohol Device Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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