Industry Directory | Manufacturer
Precision analytical x-ray instrumentation for materials analysis in research, failure analysis, and quality control applications. Elemental and compound information at microscopic and macroscopic levels with x-ray microanalysis (EDS/WDS/EBSD) and x-ray fluorescence (EDXRF) products.
Failure analysis - Components as well as PC boards, Discretes, Passives ICs - offering X-ray. SEM/EDX -XRF - Cross sectioning complete root cause F/A
New Equipment | Assembly Services
1. PCB transmission machine: For the connection between SMT production lines, Du can also be used for PCB buffering, inspection, Zhi test or manual insertion of electronic components. 2. Application range: dao50mm-500mm wide PCB board. 3. Responsi
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
Electronics Forum | Wed Apr 16 01:40:17 EDT 2003 | praveen
Hi , We are using water wash solder paste to solder the SMT LED's manufactured by Chicago Miniature lamp (CMD93-21 & 22)and Kingbright. Achieving the solder fillet , wetting has no issue but we observe high fallout at the functional testing. If we do
Electronics Forum | Thu May 08 10:16:17 EDT 2003 | davef
Observations are: * Center most lead of the fuse on the top right of the assembly looks like it has excellent solder flow, but this is PTH. From the amount of solder, it must have been wave or hand soldered. * Center most lead of the fuse on the bot
Used SMT Equipment | Pick and Place/Feeders
DEK 03IX automatic solder paste printing machine features advanced up/down k-view vision system, independent control and adjustment of lighting, high-speed moving lens, accurate alignment of PCB PCB and net board. The DEK Horizon 03IX automatic solde
Used SMT Equipment | AOI / Automated Optical Inspection
We have a Very nice CR Technology AOI Machine For Sale. Machine has been powered up and is in Good Working Condition. Included is a copy of the software CD and Manual for the machine. See attached pictures and information belo
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Parts & Supplies | Pick and Place/Feeders
JUKI 2050 machine failure solution KE2050M Z-axis fault E620014 error handling method! Suddenly heard the sound of the machine. The machine stopped the fault for the E620014Z axis drive alarm. View the drive. For Z drive 1, the third light is on
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Parts & Supplies | Pick and Place/Feeders
CBA40 198041 GREEN camera for DEK Repair CBA40 198041 Green Camera for DEK printer DEK printer repair DEK printing machine servo drive repair DEK printing machine VISION card repair DEK printer servo card repair DEK printer servo motor repair
Technical Library | 2013-04-25 11:42:01.0
Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure analysis on high-speed PCBs. The development of a quality-assurance method to verify the use of foils with specified roughness grade during the PCB manufacturing process is also important... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2022-09-25 20:03:37.0
Cracking remains the major reason of failures in multilayer ceramic capacitors (MLCCs) used in space electronics. Due to a tight quality control of space-grade components, the probability that as manufactured capacitors have cracks is relatively low, and cracking is often occurs during assembly, handling and the following testing of the systems. Majority of capacitors with cracks are revealed during the integration and testing period, but although extremely rarely, defective parts remain undetected and result in failures during the mission. Manual soldering and rework that are often used during low volume production of circuit boards for space aggravate this situation. Although failures of MLCCs are often attributed to the post-manufacturing stresses, in many cases they are due to a combination of certain deviations in the manufacturing processes that result in hidden defects in the parts and excessive stresses during assembly and use. This report gives an overview of design, manufacturing and testing processes of MLCCs focusing on elements related to cracking problems. The existing and new screening and qualification procedures and techniques are briefly described and assessed by their effectiveness in revealing cracks. The capability of different test methods to simulate stresses resulting in cracking, mechanisms of failures in capacitors with cracks, and possible methods of selecting capacitors the most robust to manual soldering stresses are discussed.
Hear what attendees had to say about the Electronics in Harsh Environments Conference. Start planning your participation for the 2020 event: 21-23 April 2020 | Amsterdam, Netherlands https://www.smta.org/harsh
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ONLINE | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue Sep 24 00:00:00 EDT 2019 - Tue Sep 24 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series - Electrostatic Discharge Control - Game Changing Threats - FREE Introduction Webinar
Career Center | Toronto, Ontario Canada | Engineering,Production,Quality Control
Work on ICT and functional test failures. Troubleshoot assemblies to the component level. Minimum one year of experience in Failure Analysis or In-Circuit Testing, or a recent graduate with a heavy course emphasis in this area. Understanding of
Career Center | Oakville, Ontario Canada | Engineering,Maintenance,Production,Quality Control
To help us continue setting the pace in a rapidly changing manufacturing environment, we need people to operate state of the art manufacturing equipment, perform failure analysis and quality inspection on a wide variety of electronic assemblies. Thes
Career Center | Nariveles, Philippines | 2019-11-21 13:32:04.0
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
Career Center | Mariveles, Philippines | Engineering,Production,Quality Control
Failure Analysis Technician Quality-driven and goal-focused with strong research, planning and Problem-solving abilities. Gifted in being a technical knowledge base, Organizing workflow and improving processes.
SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/06/686047-Win98SE-Software-versions-HC1-controller.pdf
Heller Oven Software Versions for HC1 controller PN:686047 Heller Industries, Inc. Page 1 of 8 PN:686047 Heller Oven Software Versions for HC1 controller (for Windows98SE
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/mems?page=6
. • Nordson ASYMTEK automated and Nordson EFD semi-automated fluid dispensing equipment for assembly applications. • Nordson DAGE bondtesters and X-ray inspection solutions for engineering, failure analysis and production
