Electronics Forum | Wed May 11 13:27:30 EDT 2005 | Sam Ho
i want to know which type of solder paste and reflow profile can support the solder pad with nickel but not covered gold on the pcb.
Electronics Forum | Wed May 11 13:50:30 EDT 2005 | russ
I would contact your paste supplier, bare nickel can be impossible to wet to. How oxidized is it?
Electronics Forum | Thu May 12 07:54:37 EDT 2005 | Rob
We talked about something similar here: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=8051&#Message31805
Electronics Forum | Thu Jul 15 11:17:03 EDT 2010 | davef
Things don't disappear completely. If something caused nickel corrosion, the nickel corrosion by-product would be in place of the nickel. Is it possible that ... There never was any nickel? We know that the nickel will diffuse into the copper. Th
Electronics Forum | Wed Sep 01 08:27:38 EDT 2004 | davef
Zinc from the brass [Cu3Zn2] diffuses into the tin causing solderability problems. Just 0.001% of Zn in your solder can render it fit for the scrap heap. So, you need a barrier plate between the brass and the tin. Copper or nickel-plating is commonl
Electronics Forum | Mon Apr 21 16:38:45 EDT 2014 | barryg
Hello all. We have been having some problems soldering to what we believe is a nickel plated spring steel battery terminal to a PCB. We have tried scrapping , then tinning, dipping and still have problems. Are there any special fluxes or pre-treats t
Electronics Forum | Tue Nov 29 21:51:37 EST 2005 | wmeyers
I have a pin and sleeve assembly that utilizes a fusible link type of solder, Bi, Cd, Pb and Sn alloy. The pin is gold plated, the sleeve is copper alloy 725. I have had sporadic success with wetting of the sleeve during the reflow process. To improv
Electronics Forum | Mon Apr 28 09:59:04 EDT 2003 | davef
Your customer's question is reasonable. Soldering to nickel is not always a walk on the beach [can of corn, or whatever]. This issue is flux not solder. Your Sn63 will have plenty of strength, providing the solder connection is well formed. You s
Electronics Forum | Thu Mar 31 19:52:50 EST 2005 | davef
We agree with Russ that you're talking palladium instead of platinum. Your wetting problem likely is not the Pd-Ag surface layers, but the underlying metal or nickel to which you need to wet. Either a base metal is: * Contaminated and poorly wettabl
Electronics Forum | Thu Dec 12 13:37:33 EST 2002 | gregoryyork
Have you considered the plating of the component could be Pb free as this generally wont be liquidus until 232C typically. seeing more and more of these unmarked components coming through so worth checking latest batch of problems on unmarked QFP's a
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