Industry News | 2003-06-09 08:40:10.0
The Opening Session and Annual Meeting during SMTA International will be held on Tuesday, September 23.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2003-07-08 09:48:46.0
taking place September 28-October 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2015-09-03 16:37:18.0
SMTA China announces that it presented awards for seven papers at the SMTA China South 2015 Conference Award Presentation Ceremony, held on Tuesday, August 25, 2015 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2020-02-11 04:22:16.0
Providing process information and solving process defects is what I have been doing for many years with different organisations. In addition we have in the past created reports on 0201 assembly and testing of PCB surface finishes for lead-free assembly
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
Industry News | 2019-06-02 18:40:27.0
SHENMAO America, Inc. introduces SMF-WC53 Water Soluble Ball-Attach Flux and Solder Sphere for use in ball-attach processes. With excellent solderability and high reliability, SHENMAO’s solder sphere can be used in a wide range of solder applications with various sizes from 50-760 μm.
Industry News | 2008-10-29 18:01:57.0
GREELEY, CO � October 2008 � FCT Assembly announces that FCT Asia has appointed Electroloy Metal to distribute the FCT assembly products including the Nihon Superior SN100 lead-free solder for sales in Hong Kong and China.
Industry News | 2007-11-01 20:33:22.0
ITASCA, IL � November 1, 2007 � Kester announces it will launch the new EnviroMark 919G (EM919G) lead-free solder paste in Hall A4, Stand 363 at the upcoming Productronica 2007 exhibition and conference, scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
