Electronics Forum | Tue Feb 06 13:16:09 EST 2007 | jaimebc
Leaded paste, is what we use if the process or product requires it.
Electronics Forum | Mon Feb 05 21:56:31 EST 2007 | ViVian
what type of solder paste I should use if Rohs and non rohs component mount on same board
Electronics Forum | Tue Feb 06 13:24:31 EST 2007 | stepheniii
Good afternoon, > > You have to use lead paste > since none-RoHS components won�t withstand > elevated temperatures. Solder paste manufacturers > offer a lot of transitional pastes designed > specially for mixed process. Ask your paste > suppli
Electronics Forum | Mon Feb 19 15:32:42 EST 2007 | blnorman
We use SnPb paste and bar with leaded and non-leaded component finishes. The predominant finish on components we use is Tin, there are a few NiPdAu. We've had no problems with the component finishes used in the SnPb process.
Electronics Forum | Tue Feb 06 12:53:59 EST 2007 | CK Flip (MOTW)
ViVian, check the great SMT archives. Below is a good thread on this very topic. :-) http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=11344&#Message47106
Electronics Forum | Tue Feb 06 21:43:11 EST 2007 | Wayne
If it is instructed to ship lead free product to customer, then low temp lead free solder paste can be considered. For example, Viromet solder paste from Singapore Asahi (peak temp is between 220 to 225 degree C).
Electronics Forum | Tue Feb 06 06:41:53 EST 2007 | pavel_murtishev
Good afternoon, You have to use lead paste since none-RoHS components won�t withstand elevated temperatures. Solder paste manufacturers offer a lot of transitional pastes designed specially for mixed process. Ask your paste supplier for transitional
Electronics Forum | Mon Feb 12 17:05:29 EST 2007 | Jose
Today is more complicate to find components with lead than with "lead free", and the, I think that you have very feww lead components. And, if don�t work on exceptionals companies, you MUST use LEAD FREE PASTE. In one case, or in the opposite, the re
Electronics Forum | Fri Dec 15 14:42:35 EST 2006 | russ
we have has to alter some footprints to facilitate component rework/removal. We have some assemlies that have 2 oz and heavier copper, these boards require a lrger tip to melt solder so we have had to extend pads to allow the larger tips to touch pa
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