Industry Directory | Distributor
Provider of Task /work area lighting including magnifiers.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Curing Equipment
压力固化烤箱（PCO）或高压容器用于使空隙最小化并增加通常用于贴装附着和底部填充应用中的粘合工艺的粘合强度。 PCO将空气加压到刚性容器中，并通过强制对流加热和冷却。 加热器，热交换器和鼓风机位于压力容器内部。 固化过程完成后，压力固化炉会自动将压力降低到1atm并冷却。 工艺规格： 处理时间：通常为120分钟或用户指定的时间 工作温度：60oC〜200oC 最高温度：220oC 工作压力：1 bar – 10 bar 能力值：24个弹夹(标准) 冷却方
Electronics Forum | Thu Mar 24 07:06:06 EST 2005 | davef
There's a lot of comparison tables on the web. Here's one: Properties - Summary [A Winlow Circatex] Attribute||Hasl||Immersion Silver||Immersion Tin||Electroless Pd||OSP||Eless Ni / Imm Au Shelf Life (months)||12||12||12||12||12||6 Multiple Reflows
Electronics Forum | Mon Oct 16 11:12:42 EDT 2000 | NLykus
CEM 1 is a laminate base board material. The other boards in the experiment were manufactured using FR4 as the base board material. What I'm leaning towards is that the glass transition temperature "Tg". What do you think? Topside temperatures in
Used SMT Equipment | Soldering - Reflow
Heating zones: 5 Cooling zones: 2 Total heating length: 66 in. Total cooling length: 26 in. Total process length: 127 in. Total on /off load length: 11 in. Overall system length: 138.5 in. Overall system width: 52 in. Overall system height: 5
Used SMT Equipment | In-Circuit Testers
JDSU TB-2310-V6-OC48 JDSU TB2310 OC-48 Dual Wavelength (1310/1550nm) Package Consists of TB2000-V6 User Interface module and TB2310-OC48 DFC Application Module - See more at: http://www.testequipmentconnection.com/70841/JDSU_TB-2310-V6-OC48.ph
Industry News | 2011-08-24 22:37:23.0
The SMTA announced that it will hold sessions and a tutorial on Package-on-Package (PoP) surface mount stacking at their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Industry News | 2013-09-24 14:34:40.0
In the cool November weather in Munich, IPC’s Hand Soldering Competition is sure to heat things up at productronica 2013, stand A3.415.
Parts & Supplies | Pick and Place/Feeders
We have a large number juki spare parts in stock. And provide repair service for juki parts. If you have interested please email to us: Juki KE730/750 Laser: E9631721000 Model: 6604054 Juki KE740/760 Laser: E9635721000 Model: 6604096 JUKI KE205
Parts & Supplies | Component Packaging
C200H-CPU01 C200H-CPU02 C200H-CPU03 C200H-CPU11 C200H-CPU21 C200H-CPU31 C200HS-CPU01 C200HS-CPU21 C200HS-CPU31 C200HE-CPU11 C200HE-CPU32 C200HE-CPU42 C200HG-CPU33 C200HG-CPU43 C200HG-CPU53
Technical Library | 2007-05-09 18:26:16.0
High Density Interconnect (HDI) technology is fast becoming the enabling technology for the next generation of small portable electronic communication devices. These methods employ many different dielectrics and via fabrication technologies. In this research, the effect of the proximity of microvias to Plated Through Holes (PTHs) and its effect on the reliability of the microvias was extensively evaluated. The reliability of microvia interconnect structures was evaluated using Liquid-To-Liquid Thermal Shock (LLTS) testing (-55oC to +125oC). Comprehensive failure analysis was performed on microvias fabricated using different via fabrication technologies.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
JDSU TB-2310 TB2310 OC-48 Dual Wavelength (1310/1550nm) Package - See more at: http://www.testequipmentconnection.com/70878/JDSU_TB-2310.php#sthash.ByomqDH8.dpuf
Events Calendar | Thu Apr 15 00:00:00 EDT 2021 - Thu Apr 15 00:00:00 EDT 2021 | ,
LA/OC Chapter Meeting and Technical Presentation: Manufacturing Simulation
Events Calendar | Thu Jun 08 00:00:00 EDT 2023 - Thu Jun 08 00:00:00 EDT 2023 | ,
SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
Career Center | , Texas USA | Engineering
Exciting Test Engineering opening with a Fortune 100 OEM electronic Manufacturer located in Texas. Rapidly growing corporation is in search of a seasoned RF Test Engineer. The right individual will possess: Hands-on experience in RF equipment up to
