Electronics Forum: oxygen content (Page 1 of 1)

Reflow Oven Standard oxygen content

Electronics Forum | Thu Jun 10 13:29:21 EDT 2021 | edgar_smt_ap

Good morning. What should be the Oxygen content Standard in an Oven? Here in my company, we have an ERSA reflow Oven, and we work with Lead Free solder paste. According to Work Standard documents send by my company corporate, the PPM Oxygen conte

Reflow Oven Standard oxygen content

Electronics Forum | Thu Jun 10 16:33:55 EDT 2021 | cyber_wolf

I am not aware of a "standard" I can tell you from experience that at

Reflow Oven Standard oxygen content

Electronics Forum | Wed Jun 16 07:01:26 EDT 2021 | tommy_magyar

Hi Edgar, I am not aware of any standards either, but from own experience can tell that if there are boards going through oven with PPM between 1500-2000 the solder will be dark (unaesthetic) although some of our customers accepted them if they were

Re: How to measure N2 in reflow oven

Electronics Forum | Tue Mar 09 07:06:42 EST 1999 | Charles Stringer

| | | | I need to setup an oven to run with a nitrogen atmosphere for | | boards with BGA's, but our ovens do not have the optional atmosphere monitor and controller. Is there a good way to sample and control the atmosphere without the optional bui

Re: Dross Removal

Electronics Forum | Tue Dec 12 13:33:52 EST 2000 | justin medernach

Dross removal is dependent upon the "activity" in your solder pot and the usage of a inert or an "air" atmosphere. The more moving that agitate the solder, the more dross. Basics first and then the answers will make sense. What is dross? Oxidatio

what I meant to say was....

Electronics Forum | Tue Dec 12 13:45:23 EST 2000 | justin m

Dross removal is dependent upon the "activity" in your solder pot and the usage of a inert or an "air" atmosphere. The more moving parts that agitate the solder and expose it to air, the more dross. Basics first and then the answers will make sense

Re: Drying ICs any advice

Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson

| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin

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