Technical Library: package and corrupt (Page 1 of 7)

Dam and Fill Encapsulation for Microelectronic Packages

Technical Library | 1999-08-27 09:29:49.0

Contract packaging houses have to contend with a large mix of die types and products. Flexibility and quick turnaround of package types is a must in this industry. Traditional methods of die encapsulation, (i.e., use of transfer-molding techniques), are only cost effective when producing a large number of components. Liquid encapsulants now provide similar levels of reliability1, and are cost effective...

ASYMTEK Products | Nordson Electronics Solutions

LED Lens Production Line Solutions: The Complete Package for Efficient and Reliable LED Lens Manufacturing

Technical Library | 2023-09-18 03:53:42.0

好的,以下是根据标题"LED Lens Production Line Solution"写的SEO元描述和标题: SEO Meta Description (300 characters) LED Lens Production Line Solutions: The Complete Package for Efficient and Reliable LED Lens Manufacturing Our LED lens production line solutions are the perfect way to improve your LED lens manufacturing efficiency and reliability. Our solutions include all the equipment and services you need to produce high-quality LED lenses, from lens molding to assembly.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Assembly and Reliability of 1704 I/O FCBGA and FPBGAs

Technical Library | 2013-03-14 17:19:28.0

Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.

Jet Propulsion Laboratory

A High Performance and Cost Effective Molded Array Package Substrate

Technical Library | 2010-11-18 19:19:50.0

In this article we present both a relatively new and innovative family of packages that is suitable for medium pin count needs and an innovative method for fabricating the substrates for such a package. With respect to lead count, this packaging family is

EoPlex Technologies, Inc.

2.5D and 3D Semiconductor Package Technology: Evolution and Innovation

Technical Library | 2017-09-14 01:21:52.0

The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the shorter interconnect resulting from this effort has contributed to improving both electrical performance and functional capability. (...) This paper outlines both positive and negative aspects of current 3D package innovations and addresses the challenges facing adopters of silicon and glass based interposer fabrication. The material presented will also reference 3D packaging standards and recognize innovative technologies from a number of industry sources, roadmaps and market forecasts.

Vern Solberg - Solberg Technical Consulting

Package-on-Package (PoP) Warpage Characteristic and Requirement

Technical Library | 2021-12-16 01:48:41.0

Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.

Intel Corporation

Failure Modes in Wire bonded and Flip Chip Packages

Technical Library | 2014-12-11 18:00:09.0

The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame (...) The paper provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. The root cause evaluations and lessons learned as the factory transitioned to thin form factor packages are shared

Peregrine Semiconductor

Organic Flip Chip Packages for Use in Military and Aerospace Applications

Technical Library | 2006-11-14 12:48:31.0

Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package

i3 Electronics

Wafer-Level Packaging (WLP) and Its Applications

Technical Library | 2023-10-23 18:28:42.0

This application note discusses the Maxim Integrated's wafer-level packaging (WLP) and provides the PCB design and surface-mount technology (SMT) guidelines for the WLP

Maxim Integrated Circuits

HALT/HASS and Thermal Cycling to Assess COTS Boards, GoPro Camera and Advanced PBGA/CCGA Virtex-5Electronic Packages

Technical Library | 2023-08-14 21:16:13.0

Outline Introduction Objectives Hardware to be assessed COTS Xilinx and Microsemi ProASIC Boards Advanced CCGA/Virtex-5Daisy Chain Package (Kyocera) Assembled Advanced SMT packages (PBGA) COTS GoPro Camera Experimental Details Test Results/Discussion Summary Acknowledgements

NASA Office Of Safety And Mission Assurance

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