Industry News: packaging materials (Page 1 of 221)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

See GPD Global's PCD Technology at IMAPS Device Packaging 2011

Industry News | 2011-02-17 15:04:54.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #27 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort and Casino in Scottsdale, AZ.

GPD Global

DuPont Electronic Technologies' Printed Circuit Materials Division Announces Price Increase for Riston� Photopolymer Dry Film Resists

Industry News | 2003-06-04 08:27:58.0

DuPont cites rising raw material, transportation and energy costs as reasons for the increase.

SMTnet

Register for the World's Largest Event for Medical Device Manufacturing

Industry News | 2003-05-08 07:22:00.0

Over 400 contract manufacturers present every aspect of outsource capability.

SMTnet

Cookson Assembly Materials Announces Price Increase

Industry News | 2003-02-24 09:54:40.0

Effective March 3, Cookson Electronics Assembly Materials (Jersey City, NJ) will increase prices for its products by an average of 3 percent, the company announced today.

SMTnet

DuPont Electronic Technologies To Appoint Insulectro as National Distributor for Circuit Materials

Industry News | 2003-06-16 08:33:59.0

This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.

SMTnet

MIRTEC Names ARK Manufacturing As Its Representative For Arizona

Industry News | 2011-01-20 12:39:04.0

MIRTEC, "The Global Leader in Inspection Technology," appoints ARK Manufacturing Solutions, LLC as its manufacturers’ representative for Arizona.

MIRTEC Corp

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

Universal Appeal for Educational Package

Industry News | 2003-03-25 09:24:51.0

The Cadstar Universal package enables educational establishments to provide multiple licences of current generation PCB design solutions for students at a cost equivalent to a standard single licence.

SMTnet

MIRTEC RECEIVES A GLOBAL TECHNOLOGY AWARD FOR ITS MV-9XP LED PACKAGE INSPECTION SYSTEM

Industry News | 2013-11-13 12:39:14.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2013 Global Technology Award in the category of LED Production Equipment for its MV-9XP LED Package Inspection System.

MIRTEC Corp

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