Industry Directory: packing (88)

Clariant Cargo & Device Protection

Clariant Cargo & Device Protection

Industry Directory | Other / Component Packaging

Clariant Cargo & Device Protection offers a complete portfolio of desiccants and humidity indicator cards for use in dry packing.

Plastlist Group

Plastlist Group

Industry Directory | Antistatic / Component Packaging / Drilling / Routing / Soldering / Tape and Reel Services

Plastlist is a professional industrial solution provider, who is in engaged in design, manufacturing, equipment agency, material & accessories supply.

New SMT Equipment: packing (46594)

iineo+ Pick & Place System With Integrated Component Tester

iineo+ Pick & Place System With Integrated Component Tester

New Equipment | Pick & Place

The new iineo+ is a highly specified machine , configured with new design, new RC 5.16 platform software and integrated electrical tester. It delivers a step-change in value for production-wide management, process refinement and user accessibility.

EUROPLACER

Szero PCB Storage Cabinet

Szero PCB Storage Cabinet

New Equipment | Board Handling - Storage

SzeroPCB is a dry cabinet for PCBs that offers a controlled Relative Humidity environment of less than five percent. This cabinet complements the Lzero3 Automatic Storage Cabinet and is directly controlled by the WMS software of the Lzero3. For each

EUROPLACER

Electronics Forum: packing (445)

Silica gel in final packing

Electronics Forum | Mon Jun 30 22:02:43 EDT 2003 | davef

If you don't seal your packaging, the silica gel will try to remove the moisture from the air and will become saturated pretty quickly. There is no requirement that you pack/ship with dessicants. Some customers require such things though. Why do y

Silica gel in final packing

Electronics Forum | Sat Jun 28 22:52:34 EDT 2003 | ramanandkini

We have an Electromechanical assembly (clock) that has a step motor on the board. This electromechanical assembly is assembled in a screw less plastic moulded casing. The plastic casing is neither air tight nor water proof. The board is with SMOBC+ H

Used SMT Equipment: packing (174)

Electrovert Vectra Elite Wave Solder

Electrovert Vectra Elite Wave Solder

Used SMT Equipment | Soldering - Wave

Windows: XP Version 2002, Service Pack2, KBM Premium Industrial Computer. Vectra Software: Version 3.05.0 Titanium Solder Pot w/ Custom 12” Titanium Ducts/Nozzles (Ultra-Fill & Rotary Chip Wave). Bar Solder Feeder Titanium Solder Pump

Capital Equipment Exchange

Teradyne Spectrum 8800 Series

Teradyne Spectrum 8800 Series

Used SMT Equipment | General Purpose Test & Measurement

TERADYNE, Testing Machine, type Spectrum 8800 Series, SN: 8855-088, with inside 30 cards modules, included Pentium PC inside, software Windows NT, Service Pack 6, with keyboard and flat screen, n.1 vacuum pump, size approx. 2, 30 x 1, 80x1, 60 meters

Baja Bid

Industry News: packing (320)

New iineo+ Placement Platform Launches in Europe at SMT Nuremberg.

Industry News | 2017-04-23 11:59:41.0

Europlacer announces the European launch of its newest pick & place machine, the iineo+ platform, positioned at the top of its product range. Based on the company’s industry-leading iineo machine, the new iineo+ platform includes an integrated component electrical tester, a new operating system, multi core processing and improved operator interface, as well as optional upgrades for enhanced traceability. The iineo+ platform will be unveiled on the Europlacer booth 4-251 at the SMT Hybrid Packaging event.

EUROPLACER

Europlacer to Demo High Performance SMT Pick and Place Platforms at APEX

Industry News | 2012-02-09 22:04:13.0

Europlacer will demo its award-winning iineo II and XPii-II SMT pick-and-place platforms in booth number 3015 at APEX 2012.

EUROPLACER

Parts & Supplies: packing (2035)

Samsung O Ring For Samsung CP45 Multi Cylinger J9057035C Whole sets Black Rubber packing

Samsung O Ring For Samsung CP45 Multi Cylinger J9057035C Whole sets Black Rubber packing

Parts & Supplies | Assembly Accessories

Detailed Product Description Part Name: O Ring Part Number: J9057035C Usage: Feeder Cylinder Material: Rubber Color: Black Condition: New O Ring For Samsung CP45 Multi Cylinger J9057035C Whole sets Black Rubber packing Description: Part N

KingFei SMT Tech

Technical Library: packing (151)

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Advanced Solder Paste Dispensing

Technical Library | 2008-10-15 20:16:12.0

Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.

Nordson ASYMTEK

Videos: packing (103)

Humidity Indicator Card Type 2 Non Reversible - Humitector™

Humidity Indicator Card Type 2 Non Reversible - Humitector™

Videos

A Sustainable Alternative - Humitector™ Type 2 cards are halogen-free and cobalt dichloride free. For more information on Type 2 Humidity Indicators, visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-

Clariant Cargo & Device Protection

Humidity Indicator Card Type 2 - Humitector™ Non Reversible, Halogen-Free & Cobalt Dichloride Free

Humidity Indicator Card Type 2 - Humitector™ Non Reversible, Halogen-Free & Cobalt Dichloride Free

Videos

A Sustainable Alternative - Humitector™ Type 2 cards are halogen-free and cobalt dichloride free. For more information on Type 2 Humidity Indicators, visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-

Clariant Cargo & Device Protection

Training Courses: packing (2)

Altium Designer Essentials Course

Training Courses | | | PCB Design Courses

The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.

Altium

BGA Rework/Profiling Training Course

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

BEST IPC Training

Events Calendar: packing (14)

Semicon West

Events Calendar | Tue Jul 10 00:00:00 EDT 2018 - Thu Jul 12 00:00:00 EDT 2018 | San Francisco, California USA

Semicon West

Clariant Cargo & Device Protection

IPC APEX EXPO 2020

Events Calendar | Sat Feb 01 00:00:00 EST 2020 - Thu Feb 06 00:00:00 EST 2020 | San Diego, California USA

IPC APEX EXPO 2020

Association Connecting Electronics Industries (IPC)

Career Center - Resumes: packing (16)

Production Manager

Career Center | Silvassa, India | Production,Quality Control,Sales/Marketing

Experience in Electronics manufacturing line including SMT Processes

Production Supervisor

Career Center | DALLAS, Texas USA | Production

Extensive, diverse background in Production Management and Warehousing in state of the art manufacturing environments.  Exceptional ability to translate corporate strategies and orchestrate between business components, resulting in deliverables on ti

Express Newsletter: packing (41)

Partner Websites: packing (6514)

ROHS Compliance & Wood Packing Compliance

ORION Industries | http://orionindustries.com/rohs.php

ROHS Compliance & Wood Packing Compliance ISO 9001:2015 Registered AS 9100 Registered UL Recognized SAM Registered ROHS Compliance ROHS Compliance Orion Industries Incorporated is committed to providing product which is compliant with all applicable

ORION Industries

Packing Instructions for DS Series Dispense System

GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Packing-Instructions-DS-Series-Dispenser-22290017.pdf

Packing Instructions for DS Series Dispense System Prepare & Pack Dispenser for Transport DS Series Dispense System Precision Dispensing Systems Safety Notice Tools, Equipment, Documentation

GPD Global


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