FUJI High Performance NXT-H Hybrid Chip Mounter If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place
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Electronics Forum | Mon Feb 13 01:47:28 EST 2017 | soldertraining
Solder flux and solder paste deposition is a standard step during the chip attach and sphere attach portions of BGA and CSP assembly. A technique called ultra-violet fluorescence intensity mapping (UV FIM) has been introduced that allows flux measure
I have a Panasonic chipshooter MV2C-A XL for sale. It is fully functional but some heads requires alignment, last time we used it a servo was replaced and some heads had to be aligned again (we can do it if it is required). Machine's maintenance se
Industry News | 2009-06-12 13:56:24.0
Orchid Technologies featured in COTS Journal
Industry News | 2009-08-04 12:09:00.0
The 15th annual NEPCON/EMT South China 2009 event for the China electronics manufacturing industry will take place from August 26-28, 2009 at the Shenzhen Conference & Exhibition Center. When attending the NEPCON show, visitors will have the opportunity to take part in EMT South China, Finetech South China, ATE China and AE South China, which take place simultaneously.
RHS2B Anvil Lever N610082093AA SMT RH AI Spare Parts X01L51007B For RL131 RL132 Metal Senso N610082091AA UPPER ANVIL UNIT ｱﾝﾋﾞﾙｼﾞｮｳﾌﾞﾕﾆｯﾄ 2 001 X02G51201 PIN ﾋﾟﾝ 1 002 X02G5120301 ANVIL(UPPER) ｱﾝﾋﾞﾙ(ｱｯﾊﾟｰ) 1 003 X01L51002 GUIDE PLATE ｶﾞｲﾄﾞﾌﾟﾚｰﾄ
JUKI YC or Z GREASE MGREAS050GA 40031411 BARE ADJUSTMENT JIG 40031620 LOAD CELL ASM HLC-5N 40031754 I-CX PCB 40031812 LINEAR SCALE X ASM 40031860 Y BEAR CABLES ASM 40031861 XY BEAR HEAD CABLES ASM 40032048 IN STEPPING MOTOR ASM 40032049 OUT
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Technical Library | 2017-06-29 16:39:30.0
Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test labs take different approaches to determine these properties. It is common for these different approaches to yield varying values of key properties like permittivity and loss tangent. The D-24C Task Group of IPC has developed this round robin program to assess these various methods from the "bottom up" to determine if standardized methods can be agreed upon to provide the industry with more accurate and valid characteristics of dielectrics used in high-frequency and high-speed applications.
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