SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
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Electronics Forum | Thu Aug 08 13:05:45 EDT 2019 | horchak
What is your pad width? What is lead width? Is the part gang masked, or has masking between the pads? Pads plated or HASL, if HASL how thick? What is board thickness and size? Does it need to be fixtured for support thru out the process. Semi auto sc
Electronics Forum | Sun May 21 23:29:38 EDT 2017 | zsoden
Hi all, We run an old Seho 1135C wave solder with a 63/37 pot at 250°C. It has been running well for a couple of years but we have noticed lately that all of the larger pads (terminal blocks, transformers, etc.) require additional solder to be appli
Technical Library | 1999-08-27 09:24:56.0
Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.
Technical Library | 2010-03-23 11:50:22.0
This document discuss how to design SMT stencil base on IPC-7525. Introduction: PCBA (Printed Circuit Board Assembly) is a segment of printed circuit board technology. This segment of printed circuit board industry is concentrated in assemble all the pieces of electronic industry to one piece before output them to market. This segment covers: interconnection technology, package design technology, system integration technology, board and system test technology
:02:48 PM January 22, 2019 writer: G 1. Pad and aperture In the case of ensuring that the minimum spacing of the wiring does not violate the electrical spacing of the design, the pad design should be large to ensure a sufficient loop width
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