Technical Library: parts and cleaner (Page 1 of 3)

KE-2050/KE-2060 Causes and Countermeasures of Patch Failure

Technical Library | 2023-07-22 02:26:05.0

Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

00345186 27856240 0020 5283 pick and place parts L&A Ea Mch Fuehrungswagen Kwve

Technical Library | 2022-10-31 09:05:54.0

Warranty: 3 Months Precision: High Precision Certification: CE,ROHS Wight: 1kg Automatic Grade: Automatic Trademark: Ultra High-speed Chip Mounter High Light: 00345186, 00345186 smt pick and place parts, 00345186 SMT Spare Parts

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Materials Compatibility and Aging for Flux and Cleaner Combination

Technical Library | 2016-05-30 22:54:52.0

New engineered cleaning and defluxing agents promise great improvement in cleaning and reliability for electronic assemblies. As complexity grows and dimensions shrink in high reliability electronics, the need for materials compatibility and effectiveness in cleaning and rinsing is vital.

Sandia National Laboratories

A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation, Collaboration, and Cloud Computing

Technical Library | 2012-01-26 20:28:34.0

In electronics design, Computer Aided Design (CAD) tools manage part data in a logical schematic view (a part symbol) and a physical PCB view (a part footprint). Yet, a part has a third view, which CAD tools ignore – its supply data (Manufacturer part num

UCLA - Networked & Embedded Systems Laboratory

Dust removal in temperature and humidity Test Chamber (2/2)

Technical Library | 2019-05-21 00:21:26.0

Continue to talk about the dust removal from temperature humidity test chamber. Cleaning and maintenance: 1) Pls remove internal impurities inisde chamber before operation. 2) The power distribution room should be cleaned at least once a year, and the dust can be removed by vacuum cleaner. 3) The exterior chamber must also be cleaned more than once a year, which can be wiped with soapy water. Inspection and maintenance of humidifier: The water storage in humidifier should be replaced once a month to ensure clean water quality, humidifying water tray should be cleaned once a month to ensure smooth flow of water. The inspection of over-temperature protector:during the test: If the temperature is over 20 ℃ ~ 30 ℃ than the maximum value setted,the power supply of the heater will stop, the "OVERHEAT" overt-emperature warning light will automatically turn on but the fan is still in operation, if the equipment runs without operator around,the operator should check the over-temperature protector in advance to ensure wether it has been setted properly before start [wet ball over-temperature protector set to 120 ℃].

Symor Instrument Equipment Co.,Ltd

Facedown Low-Inductance Solder Pad and Via Schemes

Technical Library | 2008-09-04 17:57:24.0

In the quest for lower ESL devices, having the ESL reduced in the package is only half of the battle; connecting that device to the circuit determines how much of that low ESL appears to the circuit. For this low ESL part type, it would be a shame to take a part of 200 pH and add 2000 pH to its ESL because of via patterns on the PCB.

KEMET Electronics Corporation

PCB Assembly With Obsolete Parts and Hard-To-Find Components

Technical Library | 2018-03-13 14:12:34.0

Many companies take their supply chain for granted until they need an obsolete part or a hard-to-find component. Then the importance of having resourceful contract manufacturing partners becomes an incredibly valuable asset.

Power Design Services

Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill

Technical Library | 2014-01-02 15:56:55.0

With ROHS compliance the transition to lead-free is inevitable. Several lead-free alloys are available in the market and its reliability has been the main concern. The results from this experimental research aims at making a comparison of different lead-free alloy combinations. Thermal shock and drop tests are a part of this experimental study.

Jet Propulsion Laboratory

Printed Electronics: Manufacturing Technologies and Applications

Technical Library | 2023-03-13 19:35:47.0

Translational Research in Additive Manufacturing at GTMI * Additive manufacturing/3D printing process and equipment development (e.g., metal, polymer and composites part manufacturing) * Computational modeling and simulation of additive manufacturing/printed electronics processes * Advanced materials development for additive manufacturing/printed electronics * Application development and demonstration of additive manufacturing/printed electronics

Georgia Institute of Technology

Facility Fluids Metrics and Test Methods

Technical Library | 1999-08-05 10:52:56.0

This technology transfer was prepared by the Research Triangle Institute (RTI) as part of SEMATECH's Facility Fluids Project (S100). It is a compilation of information on existing facility fluids metric and test methods. Information on standard methods was gathered from SEMATECH and SEMI. Other information was obtained from a literature search of journals and conference proceedings. The published information primarily is concerned with the test equipment used and what levels of detection and purity were found. Many of the articles discussed the use of new equipment, either commercial or experimental. Extensive annotated bibliographies are append to the report.

SEMATECH

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