Nordson ASYMTEK’s SV-100 Slider Valve dispenses paste-type fluids with metal additives better than traditional needle dispensing, using slider valve technology. This technology utilizes high-frequency, piezoelectric-drive actuation to quickly deposi
The DV-07 is a normally closed, air-actuated diaphragm valve The DV-07 dispenses low to medium viscosity fluids for a variety of applications from microdots to volume fill. The DV-07 valve tolerates aggressive fluid formulations including acid-
Universal Instruments Polaris Machine For Sale Very clean and in Good Condition See attached pictures and information below Polaris Model Number: 7514A Equipment Number: 10076306 Year 2008 Travel: 550 mm x 800mm Repeatability: +/- 0.01
Anritsu Company introduces the first battery-operated high power Passive Intermodulation (PIM) testing solution for the major wireless standards in use around the world. PIM is a form of interference generated by passive components that are normally
Industry News | 2007-11-04 19:29:37.0
DORSET, UNITED KINGDOM - November 2, 2007 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display the Xpress 25 flexible high-volume SMT placement system in booth A4-125 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2012-10-24 16:58:28.0
Europlacer, announces that it has further strengthened its solutions with the launch of a new evolution of its tape feeding solution
Although there is no question that the MYDATA Agilis feeders are nice indeed, at about $12,000.00 each for a loaded 8mm magazine make them very pricey. These TM feeders on the other hand are very affordable and fit the bill just fine where pick up ac
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Training Courses | ON DEMAND | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
SMTnet Express, June 16, 2016, Subscribers: 25,128, Companies: 14,822, Users: 40,485 Embedding Passive and Active Components: PCB Design and Fabrication Process Variations Vern Solberg; Vern Solberg - Solberg Technical Consulting Embedding
SMTnet Express, January 9, 2014, Subscribers: 26467, Members: Companies: 13548, Users: 35610 Embedded Passive Technology by Hikmat Chammas; Honeywell International Embedded Passive Technology is a viable technology that has been reliably used
: Description Reviews Also in EMPF White Papers Description Solderability of components, especially passive components, is an issue of increasing concern to the electronics industry
. Assembly process challenges include the use of finer metal powders in solder pastes and novel components and packaging technologies. Use of alloys tailored to the application, wider variety of alloy choices, and smaller passive components are among the challenges being addressed