Industry Directory | Consultant / Service Provider / Manufacturer
Design and Engineering Services in connected and non-connected devices EMS / Contract Manufacturer •ISO 9001:2015 •ISO 13485:2016 •AS9100D •FDA 21 CFR 820 Compliant •Nadcap Accredited •ITAR Registered
Industry Directory | Consultant / Service Provider
Adhesive Flip Chip Technologies, Bumping Services (Pd, NiAu, polymer...), Assembly Services (Prototyping to High Volume)
The SP28P-D Screen Printer delivers the capabilities to meet the electronic manufacturing challenges of today and tomorrow-all at a considerable cost savings.
We offer a full range of SMT adhesives that are suitable for markets ranging from automotive to consumer electronics and everything in between. These adhesives are suitable for all common application methods including printing, standard and high spe
Electronics Forum | Mon May 20 22:19:58 EDT 2013 | ultimatejoker
Which PCB pad can last longer? 1. Cu-Ni-Pd-Au 2. Cu-Ni-Pd 3. Cu-Pd-Au 4. Cu-Pd
Electronics Forum | Thu Sep 28 10:49:47 EDT 2006 | pavel_murtishev
Good afternoon, We use PD955M daily and are also happy with PD955M. Consider PD955�s printable version: PD955 PY or PD955 PR (difference is only in color: red or yellow). Do not use IPA for cleaning. IPA tends to harden adhesive making cleaning extr
Used SMT Equipment | In-Circuit Testers
Make: Agilent Model: Series 3 [E9900A] Description: In-Circuit Tester Configuration: 1 – Dual Boot Controller Setup Unix 05.21pd Windows 07.20pd 4 – ASRU C Cards 4 – Control Xt 64 Cards 36 – Hybrid Standard Do
Used SMT Equipment | In-Circuit Testers
1 – 3070 In-Circuit Tester (E1026A) 1 – Controller (HP5700 “Windows”) 2 – ASRU C Cards 2 – Control Xt Cards 18 – Hybrid Double Density Cards 2 – 6624 Power Supplies 1 – Keyboard, Mouse & Printer Software version (Unix) 05.21pd 0103 UX Softwa
Industry News | 2011-11-30 13:07:59.0
Genuine electronics manufacturing industry concerns, challenges and problems will be addressed in 50 IPC APEX EXPO professional development courses, February 26–27 and March 1, 2012, at the San Diego Convention Center.
Industry News | 2011-01-27 15:53:22.0
Providing the latest information on design innovations and best practices, the IPC Designers Forum and several design-focused educational programs and activities will be held at IPC APEX EXPO 2011, April 10–14, 2011, in Las Vegas.
Parts & Supplies | Pick and Place/Feeders
Part Name：HAND LEVER ASSY CL-16MM PART No： KW1-M324A-00X More SMT parts in stocks FUJI Fuji CP7 Solenoid valve H1007F H10066 FUJI XP242 243 Generator H1009D FUJI XPF Solenoid valve ZH05BS-01-01 H1063E VM1010-4NU-01 GA010E1-25-PS DC24V SMC So
Parts & Supplies | SMT Equipment
JUKI 2050 /2060 sensor cable Part Number : E94647250A0 More SMT parts in stocks E18-BOIN1 Sensor EE-SX471 Omron Sensor EHPJ-E21 Sanbu Switch EX-13EAD EX-13EP Sensor FUJI FS-L41 Sensor FUJI FS-L71 Sensor FUJI Fuji CP7 Solenoid valve H100
Technical Library | 2012-12-13 21:20:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) surface finish. We used lead-free solder of Sn-1.2Ag-0.5Cu-Ni (LF35). We found multiple micro-voids of less than 10 µm line up within or above the intermetallic compound (IMC) layer. The number of micro-voids increased with the palladium (Pd) layer thickness. Our results revealed that the micro-void formation should be related to (Pd, Ni)Sn4 phase resulted from thick Pd layer. We propose that micro-voids may form due to either entrapping of volatile gas by (Pd, Ni)Sn4 or creeping of (Pd, Ni)Sn4.
Technical Library | 2024-06-19 13:59:50.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments:
Make: Mydata Model: My100SX-14 Vintage: 9/2010 Description: Pick & Place Software Release: TPSys 4.2.3b for Ubuntu Linux Details: • Electrical Two-Pole Test • Electrical Transistor Test • Shared Databases • HYDRA &bu
ETA SMT PCB Stacker/Destacker If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB conveyor, PCB magazine loader, PCBA coating conveyor, pcb
Career Center | Eden Prairie, Minnesota USA | Production
Solderer ALL SHIFTS Logic PD collaborates with clients to help them launch products that accelerate growth and capture value in the Internet of Things (IoT). Logic PD helps at any stage in the product lifecycle by being the complete product innovat
Career Center | EDEN PRAIRIE, Minnesota USA | Production
Logic PD collaborates with clients to help them launch products that accelerate growth and capture value in the Internet of Things (IoT). Logic PD helps at any stage in the product lifecycle by being the complete product innovation and product realiz
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
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