963 pin discolor after reflow results

SMT Express, Volume 3, Issue No. 2 - from SMTnet.com

Anisotropic Conductive Adhesive Bonding - A high-quality Interconnection Technique

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose

SMT Express, Volume 2, Issue No. 4 - from SMTnet.com

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com

Featured Article Return to Front Page REFLOW SOLDERING

Pin in Paste Stencil Design for Notebook Mainboard

Pin in Paste Stencil Design for Notebook Mainboard If you don't see images, please visit online version at #Application.SmtNet.baseURL#/express/ Pin in Paste Stencil Design for Notebook Mainboard This paper examines the construction of a

Ceramic to Plastic Packaging

Screening for Counterfeit Electronic Components

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo

SMTnet Express - April 14, 2022