Technical Library: pin oxidation (Page 1 of 1)

Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units

Technical Library | 2018-05-23 12:12:43.0

Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.

Robert Bosch LLC Automotive Electronics Division

  1  

pin oxidation searches for Companies, Equipment, Machines, Suppliers & Information

SMTAI 2024 - SMTA International

Training online, at your facility, or at one of our worldwide training centers"
Win Source Online Electronic parts

High Resolution Fast Speed Industrial Cameras.
PCB Handling Machine with CE

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
PCB Handling with CE

Software for SMT placement & AOI - Free Download.
IPC Training & Certification - Blackfox

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.