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New Equipment | Cleaning Equipment
All kinds of printing or adhesive substrate before the surface activation, modification, grafting, roughening or cleaning. Application: ．LCM, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED packaging, SMT, PCB, FPC, optoelectronic c
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New Equipment | Cleaning Equipment
Fast removal of residual photoresist on the wafer, the wafer surface to clean, etch rates with the highest industry. Apllication: ．Surface cleaning and modification for LCD, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED Packaging,
New Equipment | Solder Materials
V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature
New Equipment | Soldering - Other
Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China Email: salemachines@bjclkdkj.cn Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496
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