Industry News: polyurethane and potting (Page 1 of 9)

GPD Global's PCD Technology Is Proven Compatible with Silver-filled Electrical and Thermal Epoxies

Industry News | 2010-12-07 14:53:07.0

GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.

GPD Global

2-Part Mixing is now Volumetric Dispensing!

Industry News | 2017-06-14 10:46:29.0

GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.

GPD Global

IPC-HDBK-850 Sets Guidelines for Potting and Encapsulating Boards

Industry News | 2012-08-09 18:42:34.0

IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.

Association Connecting Electronics Industries (IPC)

IPC/WHMA-A-620 Training and Certification Centers Up and Running

Industry News | 2003-06-18 07:47:47.0

The training certification program, which assures its participants immediate industry recognition, legitimacy and value, is designed to train operators and potential instructors on proper cable and wire harness fabrication and installation.

Association Connecting Electronics Industries (IPC)

Nordson ASYMTEK to Exhibit New Conformal Coating Line and Dispensing Solutions with SmartTec GmbH and in the Fraunhofer IZM Future Packaging Line at SMTconnect

Industry News | 2019-04-30 18:05:43.0

Nordson ASYMTEK will exhibit its new conformal coating line and dispensing solutions at SMTconnect, Nuremberg, Germany, with SmartTec GmbH in Stand 4-101 and in the Fraunhofer IZM Future Packaging Line Stand 5-434. In addition, Gerd Schulze, key account manager, Nordson ASYMTEK, will present "Protecting Electronics -- Adhesive and potting options and practical examples" at SMTconnect Technology Days. SMTconnect is being held May 7-9, 2019.

ASYMTEK Products | Nordson Electronics Solutions

Nordson Electronics Solutions introduces new SELECT Synchro selective soldering system to increase throughput and flexibility while reducing footprint and cost-of-ownership

Industry News | 2022-12-07 07:48:52.0

With synchronous motion, the SELECT Synchro system boosts throughput 20-40% for most applications in a 60% smaller footprint

Nordson Electronics Solutions

SMTA China and Hong Kong Chapter Announce 2011 Best Paper/Presentation and Best Exhibit Awards

Industry News | 2011-09-06 15:20:36.0

SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.

Surface Mount Technology Association (SMTA)

IPC Releases T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Industry News | 2015-06-18 17:23:06.0

IPC Association Connecting Electronics Industries® has released IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. This ever evolving standard provides common language of terms and definitions for the electronics industry.

Association Connecting Electronics Industries (IPC)

Nordson ASYMTEK Showcases 2-Component Large-Volume and Precision Dispensing and Coating Systems at SMT Nuremberg

Industry News | 2018-06-03 19:35:57.0

Nordson ASYMTEK will showcase a powerful array of dispensing and conformal coating systems and valves at SMT Nuremberg 2018, Nuremberg Germany, from June 5-7, in the SMARTec stand 4-401. In addition, the Spectrum™ II S2-900 precision fluid dispensing system and the Thermal Cure TC-2400 for curing underfill will be demonstrated in the Future Packaging line at Stand 5-434.

ASYMTEK Products | Nordson Electronics Solutions

Nordson ASYMTEK's Helios™ SD-960 Series Automated Dispensing System dispenses medium and bulk volume deposits of single- (1K) and two-component (2K) fluids and supports highly abrasive

Industry News | 2018-03-22 21:11:24.0

Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.

ASYMTEK Products | Nordson Electronics Solutions

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