Industry News: princeton (Page 1 of 2)

Aculon Announces Launch of NanoClear Stencil Treatment

Industry News | 2013-01-12 12:44:55.0

Aculon announces the launch of their latest generation of stencil coating technology. Aculon’s proprietary technology treats the underside of stencils to make them fluxophobic i.e. repels flux and oils.

Aculon

Indium Corporation Hires New Business Development Director

Industry News | 2007-05-09 21:56:09.0

Indium Corporation announced that Terry Guckes has been hired as Business Development Director for the Metals & Chemicals Business Unit.

Indium Corporation

CBA Group Announces New Director of Human Resources

Industry News | 2009-08-19 19:44:14.0

The CBA Group, comprised of Universal Instruments Corporation and Hover-Davis, announces the appointment of Cynthia Palka to the position of Director, Human Resources. Cynthia will report to CBA Chairman and CEO Jean-Luc Pelissier.

Universal Instruments Corporation

Daniel W. Christman Elected to Teradyne’s Board

Industry News | 2010-08-30 17:54:04.0

Teradyne, Inc. (NYSE: TER) announced the election of Daniel W. Christman to its Board of Directors.

Teradyne

Agilent Technologies Presents the 2009 Aerospace Defense Symposium "Focus Where it Counts"

Industry News | 2009-02-15 20:15:04.0

Agilent's Aerospace and Defense Symposium begins a two-month U.S. tour on February 23, 2009. The symposium provides presentations and demonstrations on how to combine design tools with cutting edge test solutions to help you build greater assurance in system readiness so you can focus on today's challenging missions.

Agilent Technologies, Inc.

Data I/O Announces Anthony Ambrose as President, Chief Executive Officer and Director

Industry News | 2012-10-26 11:31:20.0

: Data I/O Corporation (NASDAQ:DAIO), announces the election of Anthony Ambrose as President effective today, and as Chief Executive Officer effective November 14, 2012.

Data I/O Corporation

AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF)

Industry News | 2014-05-07 16:11:10.0

AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.

AI Technology, Inc. (AIT)

AI Technology, Inc (AIT) Introduces 3D-TSV Ultra-Thin Wafer Processing Temporary Bonding Adhesive Film

Industry News | 2015-03-20 09:51:33.0

THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION

AI Technology, Inc. (AIT)

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications

Industry News | 2014-09-05 13:53:06.0

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.

AI Technology, Inc. (AIT)

AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments

Industry News | 2014-10-14 11:36:35.0

AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments. AI Technology (AIT) is proud to present its improved Prima Protect™ coating line for moisture and salt fog protection.

AI Technology, Inc. (AIT)

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