PRO 1600 is a full forced air / nitrogen convection reflow oven that covers only 31" x 31" of floor space. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO
Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology. Systems are designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pit
~1485G-P6N5-C 1485G-P6N5-M5 1485G-P6R5-C 1485G-P6R5-D5 1485GF-P1N5-M5 1485GF-P2N5-M5 1485GF-P3N5-M5 1485GF-P4N5-M5 1485GF-P5N5-M5 1485GF-P6N5-M5 1485K-P1F5-C 1485K-P1F5-N5 1485K-P1F5-R5 1485K-P1F5-V5 1485K-P1F5-Z5 1485K-P1FD5-D5 1485K
The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual
Develop complete applications with ease The JTAG ProVision software suite is used to generate boundary-scan tests and in-system programming applications for assembled PCBs and systems. This professional development tool is fully automated and suppo
Features: 1. This machine selects the intelligent level sirocco and rapid infrared heating technology controlling, equipped with special design wind wheel, speed stability and uniform temperature, suit for uninterrupted soldering the LED and BGA com
The LineMaster Fusion is a revolutionary platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image and algorithm based AOI sensor technology into a dual purpose, single source solution. Key Features & B
New Equipment | Test Equipment
The boundary-scan I/O modules provide an effective means of increasing test coverage on the target board and improving the diagnostic resolution of boundary-scan testing. The modules are grouped into two general classifications: general purpose digit
HANDI-VAC KIT, Static dissipative, with conductive silicone vacuum cups. (1) 1/8" and (1) 1/4" vacuum cups on bent probes and (1) 1/8" and (1) 3/8" vacuum cups on straight probes. Our HANDI-VAC kits are a low cost pick-and-place tool that can go in
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