The anti-wobble tool is designed for enhanced functionality when handling INTEL LGA CPU products. This tool improves placment accuracy when picking processor chips from a shipping tray and placing into precision sockets. This BULB-VAC features an ant
SMT peripheral equipment mainly refers to: printing press, docking station, Mounter, reflow soldering, AOI, wave soldering and other equipment. SMT peripheral technology is similar to the original hyper threading technology. Users who have experienc
Electronics Forum | Tue Feb 16 14:40:54 EST 1999 | john hearty
Has anyone changed out the old 4400 vision processor on a Fuji IP3 and replaced it with a newer 4800 vision processor. What does it take to do this and what does it consist of doing. What do I need to order from Fuji in order to do this.
Electronics Forum | Thu May 14 05:20:31 EDT 2015 | kielbik
Hi Im looking for a person who have a experience with Intel® Core™ i3-5157U (i5) Processor soldering (CL8064701478404). I want to compare our experience because i'm not sure about aur spare parts and our soldering way. They are original or not, becau
Placement and solder joint inspection (reflow and wave soldering) Orthogonal camera module 8M (white LEDs): Field of view: 57.6 x 43.5 mm Resolution: 23.5 µm (standard), 11.75 µm (high) switchable with On Demand HR Number of mega pixel cameras:
Make: Yestech Model: 2050 Vintage: 2004 Details: • 22” x 20” in size • Vision Processor board set with PCB inspection software • Windows XP based user interface • CAD/placement interface software • Flat panel display • Industrialize
Industry News | 2011-01-05 16:07:01.0
Virtual Industries Inc. announces that it will display several advanced systems in Booth 2141 at the upcoming SPIE Photonics West exhibition, scheduled to take place January 22-27, 2011 at the Moscone Center in San Francisco.
Industry News | 2012-01-20 15:26:12.0
Virtual Industries will display several advanced systems in Booth #628 at the upcoming IPC APEX Expo.
Supply original new and original used in stocks, We also can repair the camera DEK 145550/181056 Green Camera Assy XC-75CE use for SMT PCB Equipment Printer DEK VISION Y AXIS SERVO MOTOR(DEK Y motor)133128/160706/145520 D-160706/D-145520/ D-1
KIC START profiler,kic thermal profile,smt thermal profilling Image Reflow Profile 9 6 Channel Tester Accuracy: +/-1.2°C Resolution: 0.3 °C to 0.1 °C Internal operating temperature: 0 °C to 105 °C For thermocouples: 9/12 K Ty
Technical Library | 2010-10-07 20:20:58.0
Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stackin
Technical Library | 2021-12-16 01:52:32.0
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor.
Humitector™ Type 2 delivers advanced sustainable attributes including halogen-free*, cobalt dichloride-free, and reduced cobalt dibromide content The use of Type 2 Humidity Indicator Cards with a non-reversible 60% RH spot indicator is preferr
Events Calendar | Wed Feb 15 16:00:00 EST 2017 - Wed Feb 15 16:30:00 EST 2017 | San Diego, California USA
Invited Speaker at APEX 2017 - Embracing a new Paradigm: Electronic Work Instructions
. Nordson is committed to providing sheet processors with… BKG® Extrusion Pumps Types EP-SE / EP-SF BKG® Gear Pumps type EP-SE / EP-SF are used in extrusion, compounding and polymerization processes. BKG®
! customer login required - 1 credit Status: Active Mounting Type: Surface Mount Logical Description: IC, Advanced PMU for Ingenic JZ4760/60B/70 Processors Physical Description: Quad Flat No-Lead (QFN