Industry Directory | Manufacturer
An innovative thermal management company that is dedicated to address the thermal challenges that the electronics industry is facing.
New Equipment | Rework & Repair Services
In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur
JUKI RS-1XL SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and lace machine, SMT pick and place machine, JUK
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F
MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a
Used SMT Equipment | SMD Placement Machines
HS50 Head(2008) HS50 Main computer(3set) SAEBYUK_ENG #1209, Hansoltechnopark-3cha 1597-1,KWANYANG-DONG, Dongan-Gu, Anyang-City, Kyung Ki-Do, KOREA TEL:82-31-381-1608 FAX : 82-31-381-1609 H.P :010-6782-1608
Used SMT Equipment | SMD Placement Machines
HS50 Head(2008) HS50 Main computer(3set) SAEBYUK_ENG #1209, Hansoltechnopark-3cha 1597-1,KWANYANG-DONG, Dongan-Gu, Anyang-City, Kyung Ki-Do, KOREA TEL:82-31-381-1608 FAX : 82-31-381-1609 H.P :010-6782-1608
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Parts & Supplies | Assembly Accessories
Long-term spot supply of JUKI original accessories: Juki KE 730/750 Laser(both new and used): E9631721000 Model: 6604054 Juki KE 740/760 Laser(both new and used): E9635721000 Model: 6604096 JUKI KE 2050/2060 / FX -1R Laser Original New Original Pa
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Parts & Supplies | Pick and Place/Feeders
JUKI AF, AN electric feeder: AF24FS E5005706AB0, AF24FS-OP E5007706AB0 AF05HP E1001706AB0, AF081E E1002706AB0 AF081P E1004706AB0, AN081C E1009706AB0 AF16FS E4003706AB0, AF16NS E4004706AB0 AQ02HP 40042271, AF12FS E3003706AB0 JUKI FF electric fee
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2019-06-07 14:49:54.0
ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins.
JUKI RX-6R SMD Pick and Place Machine ❙ Introduce of JUKI RX-6R High Speed Compact Modular pick and place machine, JUKI RX-6R SMT placement, JUKI PCB Chip Shooter, Speed and Flexibility for High Quality Production of any PC
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
Career Center | , | 2001-05-16 15:58:28.0
Fast growing, well funded, manufacturer with leading edge technology seeks process development engineer or technician. Must have experience developing processes for new products. - adhesive dispensing - reflow - profiling - screen print - cleaning
Career Center | Coopersburg, Pennsylvania USA | Engineering
Lutron Electronics is the world leader in the design and manufacture of architectural lighting controls and systems. Our company was founded in 1961, with the invention of the world�s first electronic light dimmer. We now have over 18,000 products
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
Career Center | Springdale, Arkansas USA | Production,Research and Development
solder, electronic assembly, pcb repair, wave solder, smt, solder pot, testing unit,dexterity, program IC's,the rest in resume
Lewis & Clark | http://www.lewis-clark.com/product-tag/hp/
HP Archives - Lewis and Clark Skip to content My Cart: 0 View Cart Checkout No products in the cart. Subtotal: View Cart Checkout Lewis and Clark We Discover Equipment Opportunities NH: 603-594-4229 FL: 813-888-7436 sales@lewis
| https://www.wesource.com/test-and-measurement-equipment/hewlett-packard-70001a-spectrum-analyzer-mainframe-w/hp-70420a-test-set-and-hp-70422a-downconvert
Hewlett Packard 70001A Spectrum Analyzer Mainframe W/ HP 70420A Test Set and HP 70422A Downconverter ID_002057 (9/22): World Equipment Source COMPANY PROFILE FINDER'S PROGRAM R1-Surplus Wesource159 CALL US
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