Electronics Forum | Tue Apr 05 15:32:49 EDT 2011 | grahamcooper22
It is one of our pastes...Almit LFM48 W TM-HP, a high reliability no clean solder paste based on SAC305 with a size 4 powder. It's a paste that works so well we have thousands of users of it worldwide. Why are you using SN100C alloy paste ? I imagin
Electronics Forum | Thu Sep 09 14:50:31 EDT 2021 | kumarb
more... if you want to source from the #1 PCB shop in China, then there is Shennan Circuits. Again, unless you have very high annual volumes, they will not deal direct. Shennan builds PCBs for the military, medical and other high profile accounts.
Electronics Forum | Sun May 17 00:41:17 EDT 2009 | microdot
hi, I am sorry if i sound offended anybody. What i meant is that we are handling boards which are from major manufacturers like hp / compaq / dell / ibm / intel. So if annybody has experience of handling it..than they may have reflow profiles of sa
Electronics Forum | Sun May 30 15:11:10 EDT 1999 | M Cox
| | | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accordin
Electronics Forum | Sun May 30 18:34:04 EDT 1999 | Earl Moon
| | | | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accord
Electronics Forum | Sun May 30 12:33:36 EDT 1999 | Earl Moon
| | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according
Electronics Forum | Wed Jan 19 00:42:09 EST 2000 | park kyung sam
In my case, when i solderd the bga in normal reflow(convection hot air). There is a lot of boid. i had tried to reduce void long time. so i reduced just a little. It did't satisfied me but now i cannot looking for the void in soldered bga i
Electronics Forum | Fri Dec 03 19:44:34 EST 1999 | Russ
Hello all, I am in the process of converting our facility to noclean processes. So far I am experiencing troubles with soldering to gold finishes. The finish is an H.P. type1. The solder joints appear dull and grainy. They seem to be very strong
Electronics Forum | Wed Apr 08 07:16:21 EDT 2009 | arrowvale
We have just switched to Almit (www.almit.com)LFM48 W TM-HP-S lead free solder paste. In general terms it is an easy printing paste, with great slump properties, wide reflow process window and offers excellent solderability on all pcb / component pa
Electronics Forum | Thu Jul 15 11:01:06 EDT 1999 | Earl Moon
| | Hello All, | | I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? | | Also anyone who is mou
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