Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Industry Directory | Manufacturer
JMJ PROFILE, INC. Specializes in G-10 and Phenolic Machining All operations are performed on multi-head CNC machines allowing high speed production and consistency. Our process is an alternative to die stamping.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro
Electronics Forum | Thu Nov 30 16:30:46 EST 2023 | kojotssss
Which profile type is used, RTS or RSS?
Electronics Forum | Thu Nov 23 11:01:21 EST 2023 | kojotssss
Perform profiling with a product where the LED is placed more than on another products. You get a valuable case with a higher delta T and possible maximum reflow temperature must use, etc. This profile will be used for similar products. You need to o
Used SMT Equipment | Soldering - Reflow
Heller REFLOW OVEN MK3 2013 Condition: 2013 USED Standard type Feel free to contact me if interested!! Availability: Available on backorder The 1800 models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per min
Used SMT Equipment | Soldering - Reflow
Heating zones: 5 Cooling zones: 2 Total heating length: 66 in. Total cooling length: 26 in. Total process length: 127 in. Total on /off load length: 11 in. Overall system length: 138.5 in. Overall system width: 52 in. Overall system height: 5
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Technical Library | 2023-01-17 17:49:30.0
Repeatability of the Temperature Profile under Load Variation
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Nano-copper sintering in formic acid vapor.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed Feb 21 00:00:00 EST 2024 - Wed Feb 21 00:00:00 EST 2024 | Menomonee, Wisconsin USA
Wisconsin Chapter In-Person PCBA Profile Workshop
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Mountainside, New Jersey USA | Sales/Marketing
Develop and execute Marketing plan Knowledge of thermocouples and oven profiling necessary establish rep sales force develop literature and train sales channel
Career Center | , | 2001-05-16 16:03:48.0
Work with a fast growing, leading edge technology manufacturer. Must know fluid dispensing profiling screen printing reflow Pay is market agnencies: will split
Career Center | , India | Engineering,Maintenance,Production,Technical Support
Hands on experience in PLC based machine, DEK Printer Machine, Camlot Glue dot machine, Fuji NXT, SPI machine, reflow: Vitronics XPM2/3, Expertise in SMT Profiling Qualification & NPI Build, Soldering defects, Analysis & rework. Line modifi
Career Center | Dargaha Road Zameen Pallavaram Chennai, Tamilnadu India | Maintenance,Technical Support
CURRENT JOB: • Responsible for four sub department as Production support, Preventive maintenance activity, Spare parts control and NPI (New product Introduction) under one Equipment department. • Take care of OEE (Overall Equipment Efficiency), MTTR
SMT Express, Volume 2, Issue No. 9 - from SMTnet.com Volume 2, Issue No. 9 Thursday, September 14, 2000 Featured Article Return to Front Page Reflow Profiling The Benefits of Implementing a Ramp-to-Spike Profile by David Suraski /AIM
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 97, (#ts#)) SMT Express, Volume 4, Issue No. 1 - from SMTnet.com Volume 4, Issue No. 1 Thursday, January 17, 2002 Featured
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/adhesive-dispensing-systems/products/applicators/truecoat-fs-slot-applicators
TrueCoat FS Slot Applicator Seriess For Reliable Adhesive Application For Flat Panels and Profiles | Nordson Adhesive Dispensing Systems Adhesive Dispensing Systems Corporate | Global Directory
| http://etasmt.com/cc?ID=te_news_bulletin,23578&url=_print
with vacuum module is continuous and allows thermal profiles to be directly ported from non-vacuum reflow applications Continuous operation facilitates low cost of ownership (COO
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