Industry Directory | Manufacturer
Manufacturer of materials for the electronics assembly marketplace. Our RoHS-compliant products include solder pastes, fluxes, solder powder, core wire and bar solder and process support products.
Industry Directory | Manufacturer
Quickturn Assembly services include: SMT,double sided ,fine pitch to 12mil,BGA, microBGA,and THRU hole, Pb free if needed. Testing, Repair, Conformal coating, Powder coating, and Potting.
New Equipment | ESD Control Supplies
Exolit OP 930 is a white, fine-grained powder based on an organic phosphinate. The product is not hygroscopic and it is insoluble in water and common organic solvents like acetone, dichloromethane, MEK, toluene. Exolit OP 930 can easily be dispersed
New Equipment | Solder Materials
Advanced Metals Technology Inc. (AMT) is the world leader in manufacturing electronic grade solder powders. Our proprietary separation process allows us to produce perfectly sized, low oxide solder powders and spheres for BGAs, while maintaining low
Electronics Forum | Tue Oct 05 04:23:38 EDT 1999 | Brian
| | | | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | | | Many tahnks | |
Electronics Forum | Mon Feb 21 17:56:44 EST 2005 | davef
You want approximately 5 particles minimum across the smallest aperture. So in the case of a 0.8mm device, we use .017" pads with a round 0.020" aperture on a 6 thou thick stencil foils. Here, 0.020" diameter equals 0.50mm. This gives us 0.50/5=10
Industry News | 2011-10-12 21:25:08.0
A-Laser will feature laser cutting for medical components in Booth #1531 at the upcoming Medical Design & Manufacturing (MD&M) Exposition
Industry News | 2022-05-18 13:07:51.0
SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
AQUBE® L Series For process safe fine cleaning of assembled PCB’s and Hybrids The new kolb AQUBE® systems are next-generation cleaning systems – even more efficient, even more compact, easy to handle and
Career Center | Duluth, Georgia USA | Management,Sales/Marketing
Over 20 years of experience selling high tech capital equipment for manufacturing. ��Accomplished in territory management, regional sales management, and key account management ��Proficient at managing several projects, coordinating engineering deve
SMTnet Express, February 13, 2020, Subscribers: 34,017, Companies: 10,974, Users: 25,597 Size Matters - The Effects of Solder Powder Size on Solder Paste Performance Credits: FCT ASSEMBLY, INC. Solder powder size is a popular topic
| http://www.szhonreal.com/productview.asp?id=102
) energy is a heat source commonly used to apply industrial coatings, like powder coating, paint and more. Infrared creates this energy with electromagnetic waves that can cure many products in mere minutes. General of machine: 1
