New Equipment | Curing Equipment
For curing and drying requirements, rehm�s RDS series is available with completely customized heating and cooling lengths. Our modular design concept allows us to outfit the RDS with any combination of heating (Convection and/or IR), cooling, and UV
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
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