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Electronics Forum | Fri Jan 09 09:43:48 EST 2009 | boardhouse
Hi Simon, The main reason that it would probably be removed would be do to lack of clearance for a soldermask dam from pad to pad. typically if the clearance from pad to pad is under .008 the solder mask dam would be removed. Min recomended dam siz
Electronics Forum | Wed Sep 22 21:12:16 EDT 1999 | se
| | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | thanks | | | | | | | We use 6 mil lasercu
. During QFP analysis, for example, the rotational acc
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