Industry News: quad and autoteach (Page 1 of 5)

Working with QFNs and QFPs

Industry News | 2018-10-18 09:05:06.0

Working with QFNs and QFPs

Flason Electronic Co.,limited

Count On Tools to Introduce New SMT Nozzles and Consumables at SMTA International 2011

Industry News | 2011-09-19 16:00:50.0

Count On Tools will introduce its latest developments in SMT nozzles and consumables in Booth #323 at the upcoming SMTA International Conference & Exhibition

Count On Tools, Inc.

Registration Open for IPC’s Conference on Solderability and Reliability for Electronics Assemblies in Budapest Industry experts to present on technical and business issues

Industry News | 2012-12-17 19:16:10.0

IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.

Association Connecting Electronics Industries (IPC)

IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest Offers Critical Information

Industry News | 2010-12-03 21:35:04.0

Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.

Association Connecting Electronics Industries (IPC)

Count On Tools Rolls Out COT Placement Nozzles for 0201 and 01005 Components

Industry News | 2011-02-07 15:28:03.0

Count On Tools Inc. introduces its new series of Custom SMT Pick-and-Place Nozzles for 0201 and 01005 Micro-Components. By working closely with a component manufacturer and leading EMS companies, Count On Tools guarantees secure picking of all fragile micro-components and accurate placement on the circuit board.

Count On Tools, Inc.

Count On Tools to Introduce New SMT Nozzles and Consumables at APEX 2011

Industry News | 2011-03-11 14:17:49.0

Count On Tools Inc. will introduce its latest developments in SMT nozzles and consumables in Booth #1965 at the upcoming at the upcoming IPC APEX conference and exhibition, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Count On Tools, Inc.

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

New SMTech / Quad replacement Display and Powerboards now available from Reprint Ltd

Industry News | 2005-06-02 07:01:43.0

New SMTech / Quad replacement Display and Powerboards now available from Reprint Ltd

Reprint Limited

Practical Components Adds Amkor's FusionQuad� Test and Thermal Cycle Boards to Its Lineup

Industry News | 2008-12-15 15:28:33.0

LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.

Practical Components, Inc.

TestWay Express Documentation for DfT, Test and Assembly

Industry News | 2012-10-29 15:45:34.0

Preview for Aster Technologies, electronica 2012, Hall A1, Booth 352

ASTER Technologies

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High Throughput Reflow Oven
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Thermal Transfer Materials.