Technical Library | 2023-09-16 07:15:41.0
SMT LED pick and place machines are essential for manufacturers of LED products. These machines can place LEDs quickly and accurately, making them ideal for mass production.
Technical Library | 2023-09-18 03:53:42.0
好的，以下是根据标题"LED Lens Production Line Solution"写的SEO元描述和标题： SEO Meta Description (300 characters) LED Lens Production Line Solutions: The Complete Package for Efficient and Reliable LED Lens Manufacturing Our LED lens production line solutions are the perfect way to improve your LED lens manufacturing efficiency and reliability. Our solutions include all the equipment and services you need to produce high-quality LED lenses, from lens molding to assembly.
Technical Library | 2023-09-16 07:08:30.0
Elevate your LED production with our cutting-edge LED high-speed pick and place machine. Experience unmatched precision and efficiency to meet your manufacturing needs.
Technical Library | 2023-09-16 07:12:35.0
Elevate your LED strip manufacturing with our top-notch pick and place machine. Enhance precision and productivity for superior results in every assembly.
Technical Library | 2023-09-16 07:10:47.0
LED high speed pick and place machines are a complex and specialized piece of equipment. In this quick guide, we will cover the basics of how these machines work, as well as some of the factors to consider when choosing one.
Technical Library | 2019-08-14 08:27:46.0
There are five forms of carrier tape sealing cracking. In particular, it is more important to seal products such as IC components (IC tape carriers) and lighter and thinner LED components (LED tape carriers).
Technical Library | 2014-09-25 18:16:47.0
For the past few years there has been a shift in the Lighting Industry that has carried over to the surface mount technology assembly line. What is this shift you may ask? Well it is the LED revolution. This revolution or change in lighting has some very promising results already in practice and many more companies looking to implement the LED technology into their product portfolio's. With a number of companies looking to expand their portfolio to include LED fixtures there has been an increase in the number of companies that have started their own SMT lines, as well as a significant number of contract manufacturers to meet this new industries demands (...)This presentation will discuss some issues in the pick and place process for LEDs and presents a method to troubleshoot and resolve these issues.
Technical Library | 2015-06-11 21:20:29.0
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements
Technical Library | 2023-09-18 14:10:01.0
As with many advancements in the electronics industry, consumer electronics is driving the trends for electronic packaging technologies toward reducing size and increasing functionality. Microelectronics meeting the technology needs for higher performance, reduced power consumption and size, and off the- shelf availability. Due to the breadth of work being performed in the area of microelectronics packaging/components, this report limits it presentation to board design, manufacturing, and processing parameters on assembly reliability for leadless (e.g., quad flat no-lead (QFN) or a generic term of bottom termination component (BTC)) packages. This style of package was selected for investigation because of its significant growth, lower cost, and improved functionality, especially for use in an RF application.
Technical Library | 2020-02-19 23:12:55.0
Silver nanowires (Ag NWs) possess excellent optoelectronic properties, which have led to many technology-focused applications of transparent and flexible electronics. Many of these applications require patterning of Ag NWs into desired shapes, for which mask-based and printing-based techniques have been developed and widely used. However, there are still several limitations associated to these techniques. These limitations, such as complicated patterning procedures, limited patterning area, and compromised optical transparency, hamper the efficient fabrication of high-performance Ag NW patterns. Here, we propose a coat-and-print approach for effectively patterning Ag NWs.
Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab
