Electronics Forum | Wed Aug 01 09:36:17 EDT 2001 | Pete Barton
Jay, > > I agree with your assement and Chips on > the Quads. I once worked at a shop that had Quads > and DynaPerts(at the time) The perts were > slower(TIME) and required(EFFORT/PEOPLE) more > MAINTENANCE(more effort more people and more > re
Electronics Forum | Sat Oct 10 11:24:50 EDT 2015 | cusackmusic
I've been running Quads for over 10 years, and I love them. I've had almost every model, from the 100, to our current IVCs, and QSP2. We are getting busier, and I'm thinking about upgrading. I have TONS of feeders, so the simple solution would be t
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2015-01-25 15:25:24.0
Kurtz Ersa North America will exhibit in Booth #2601 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. For the first time, Ersa will display the new Smartflow 2020 selective soldering system and HOTFLOW 3/20 third generation reflow oven.
Technical Library | 2024-07-24 01:04:35.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints.
KingFei SMT Tech | http://www.smtspare-parts.com/quality-11001661-yamaha-yv100ii-main-stopper-koganei-smc-air-cylinder-kg7-m9165-00x-original
: Main Stopper 2, Part Number: KG7-M9165-00X 3, Condition: original New 4, Machine: YV100II SAMSUNG CP 8mm 12mm 16mm 24mm 32mm 44mm Original new and Used Feeder SAMSUNG CP SHUTTER LEVER ASSY J7000776 Samsung CP45 J6701028A AIR CYLINDER SAMSUNG CP Vibratory stick feeder 1 Samsung CP45 PICK UP NOZZLE - 0.5/ 0.25 (CN030
| http://www.thebranfordgroup.com/dnn3/Auctions/PastSales/tabid/58/Default.aspx
Leading Aerospace Manufacturer CNC Machining & Metal Fabrication Equipment Toolroom – Presses – Furnaces – Paint Booths Air Compressors – Quality Control – Plant Support Milford, CT, Orange, CT, and Long Beach, CA TG Manufacturing #2 [Online] SOLD
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