Overview • Almost 60 times faster than the original 80C51 • Almost 5 times faster than 80C251 - at the same frequency • Quad-Pipelined architecture DQ80251 is a revolutionary Quad-Pipelined ultra high performance, speed optimized soft cor
Overview • Almost 30. times faster than 80C51 • Quad-Pipelined architecture • 24 times faster multiplication (12 times division) DQ8051XP is an ultra high performance, speed optimized soft core, of a single-chip 8-bit embedded control-ler, de
Electronics Forum | Fri Apr 23 09:13:04 EDT 2010 | kdaglio
for the last couple of days when i power up our quad iv, i get assembler is off errors. i cannot get the machine and the quad align to start. any help is gratly appreciated.
Electronics Forum | Thu Mar 03 09:45:27 EST 2011 | vinceprice
Quad IV C problem. Our machine is not placing parts. We can test each component one by one and the machine picks and places the parts correctly. When we run the machine for production it does not pick up the parts. Any ideas?
Used SMT Equipment | Pick and Place/Feeders
Quad IV C There are 2 units in the inline configuration. one with a matrix tray feeder. together these units hold up to 136 feeders and a synchronized to run in line. The Quad IV C is a reliable and proven platform with inexpensive feeders available.
Used SMT Equipment | Pick and Place/Feeders
Quad IV-C pick and place:computer & software, 2 monitors downward looking camera 2 nozzle holders Power Requirement: 110 Volts Shipping Weight: 1300 lbs. Dims: 48"L x 48"W x 69"H Manual Included In Good Condition
Industry News | 2017-08-23 11:13:41.0
Versatile Raspberry Pi-based ComfilePi models CPi-A070WR and CPi-A102WR are housed and adapted for industrial use
Industry News | 2014-09-17 10:42:30.0
JTAG Technologies is showcasing amongst other products the new JTAG/boundary-scan hardware interface product compatible with the Virginia Panel (VPC) mass interconnect system.
Parts & Supplies | Assembly Accessories
Samsung SM321 mid-section conveyor belt J6602083A The following samsung parts are all availble: J91691001A FEEDER_BOARD_BRK_ASSY J91691001A J90571006A_AS FEEDER_BASE_MODULE J70570260C TOP PLATE J68081070A HANDLE_NUMBER_STICKER J6001400650 SOC
Parts & Supplies | Assembly Accessories
Reel Stopper Assy J9065205A J9065092A Other Samsung parts on sale: J91691001A FEEDER_BOARD_BRK_ASSY J91691001A J90571006A_AS FEEDER_BASE_MODULE J70570260C TOP PLATE J68081070A HANDLE_NUMBER_STICKER J6001400650 SOCKET HEAD CAP SCREW[M4*6 (SUS)]
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Overview of Machine Vision Product's Supra E, Ultra IV and Spectra Automated Optical Inspection Systems.
TI New and Original LP875640RNFRQ1 in Stock IC WQFN-HR26 , 21+ package LP875640RNFRQ1 Automotive Quad 4A Buck Converter with Integrated Switches Today's Hot Deals: BQ24271RGER VQFN24 TI 18+ PIC18F26K20-I/SS SSOP28 MICROCHIP 21+ AUIRG4PH5
SMTnet Express, October 10, 2019, Subscribers: 32,263, Companies: 10,893, Users: 25,93 Fill the Void IV: Elimination of Inter-Via Voiding Credits: FCT ASSEMBLY, INC. Voids are a plague to our electronics and must be eliminated! Over the last few
ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
. Relative High Temperature Operating Ranges Short term (minutes/hours) 400°F (204°C) Long term (days/weeks) 300°F (149°C) IV. Static Shear ASTM D3654 - 1" x 1" sample area - aluminum foil to stainless steel Minutes to Failure Temperature Load 2 mil 5 mil 70°F
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6005.html
*6 00098617S01 BALL BEARING 00098618S01 BALL BEARING 8*22*7 60 2Z 00116076-03 Transporthight 930/950mm f. c/o table 00116088-02 Transportheight 900 f