New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
Electronics Forum | Mon Apr 04 09:35:16 EDT 2005 | russ
What are the max temp specs for each of the components? this sounds like the real problem with lead free conversion. Which parts are which? Currently we are getting ready to reball lead free BGAs back to lead for a customer that had to be lead free
Electronics Forum | Mon Mar 27 10:44:12 EST 2000 | Brian E. Steelglove
Josue, I know KME or Create makes a BP10 for BGA reballing and a BP20 for CSP. The only problem is that these machines are only used overseas so far. Brian Steelglove
Industry News | 2015-05-21 19:17:53.0
IPC-- Association Connecting Electronics Industries— ® has released a new market research study, "Issues and Outlook for Lead-Free Electronics in Military and Aerospace Applications." This study examines the current and future state of lead-free usage in high-reliability applications.
Industry News | 2009-04-13 16:26:48.0
MADISON, AL � April 2009 � STI Electronics Inc., a full service organization providing training, electronic and industrial product distribution, assembly and solder training kits, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces its Engineering, Distribution and Training Services will be featured at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
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