Industry News: recipe (Page 1 of 19)

MIRTEC Awards Murray Percival Company Manufacturer's Representative Organization of the Year 2020

Industry News | 2021-02-19 15:12:37.0

MIRTEC announces that it has named Murray Percival Company as MIRTEC's Manufacturer's Representative Organization of the Year for 2020.

MIRTEC Corp

MIRTEC AWARDS MURRAY PERCIVAL CO ‘MANUFACTURERS’ REPRESENTATIVE ORGANIZATION OF THE YEAR 2014’

Industry News | 2015-03-05 08:49:38.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that it has named the Murray Percival Company ‘MIRTEC Manufacturers’ Representative Organization of the Year 2014’. Brian D’Amico, President of MIRTEC Corp., presented the award to the company during the recent IPC APEX EXPO in San Diego, CA.

MIRTEC Corp

Proposed Merger of Beyonics and Flairis Announced

Industry News | 2003-03-25 08:31:07.0

On completion of the transaction, Flairis will become a wholly-owned subsidiary of Beyonics and its shares will be delisted from Sesdaq.

SMTnet

MIRTEC to Exhibit its Complete Line of AI-Based SMT and Automotive Pin Inspection Solutions at Productronica 2021

Industry News | 2021-10-11 16:13:11.0

MIRTEC will showcase its cutting-edge INTELLI-PRO AI Based Smart Factory Automation Solution and GENSYS-PIN Automotive Pin Inspection System in booth #461, Hall A2 at the 2021 Productronica exhibition. The world's largest exhibition for the electronic manufacturing industry will take place on Nov. 16-19, 2021, at Messe Munich exhibition hall in Germany.

MIRTEC Corp

MIRTEC to Display the 'World's Most Technologically Advanced' 3D AOI System at Productronica 2023

Industry News | 2023-10-16 12:50:01.0

MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!

MIRTEC Corp

ITW EAE Introduces Auto Exit Wing Feature for Electrovert® Wave Soldering Machines

Industry News | 2022-11-21 15:50:26.0

ITW EAE is releasing a new feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing. When the wave flow is fully optimized, the PCB 'peels' away from the solder which minimizes the opportunity for bridging defects to occur.

ITW EAE

Electrovert 'DwellFlex 4.0' Wave Solder Nozzle Wins New Product Innovation Award at IPC APEX 2020

Industry News | 2020-04-14 18:49:39.0

EAE, the Electronic Assembly Equipment division of ITW is the proud recipient of an IPC APEX 2020 New Product Innovation (NPI) Award. The award recognizes the Electrovert DwellFlex 4.0 wave solder nozzle.

ITW EAE

Vitronics Soltec Introduces 3D-Printed Twin-Nozzle for ZEVA Point-to-Point Selective Soldering

Industry News | 2020-04-14 22:14:18.0

ITW EAE is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one nozzle.

ITW EAE

ITW EAE Wins Vision Awards for MPM Paste Management System and Electrovert Adjustable Wave

Industry News | 2020-08-28 03:07:38.0

ITW EAE is proud to announce that it has earned two Vision Awards for innovative MPM and Electrovert technology developments. MPM received a Vision Award for a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. Electrovert received a Vision Award for the new DwellFlex 4.0 variable contact wave solder nozzle. The awards were presented at NEPCON Asia.

ITW EAE

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

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