Industry Directory | Manufacturer
Kaifa provides an EMS service chain integrating different services such as technology development, process design, production control, procurement management and logistics support.
The GoodBye Chain Group (GCG) specializes in environmental regulation compliance consulting, training and software tools for electronics companies that need to comply with RoHS, WEEE and other global legislation.
SIGMA Link is a powerful web-based software suite currently structured around 3 modules: SIGMA Import | SIGMA Review | SIGMA Analysis SIGMA Link is a continuous yield improvement tool to translate SPI and AOI inspection data into useful process inf
The inspection procedure of heavy, big or oddly shaped parts demands for a versatile and scalable system. The XRHGantry is a roof-mounted turnkey solution with seven programmable axes. Up to 450kV and a broad detector choice make this system the answ
Electronics Forum | Fri Sep 26 19:26:17 EDT 2014 | magan
Hi Everyone, I have an Ekra x5 printer and I'm having reference drive issues with my printer. If anyone have english operator/service manual for ekra x5? I'll be happy if someone can send me the manual for this printer. Thank you
Electronics Forum | Fri Jan 07 15:53:15 EST 2011 | tpappano
Both units have the 50 pin cable, but no drives are present. The service manual makes no reference to a disk drive (that I can find), is it possible that the floppy is a 'secret' factory tech-only service tool of some sort? Also, with the 50 pin cab
Used SMT Equipment | General Purpose Test & Measurement
SMT Intelligent Feeder Calibration Jigs CAN Install Different Brands Feeder Product Specifications/Features Name of commodity: intelligent Feeder calibration jigs Weight :45KG (net weight) the size of goods (mm): L540*W350*H600 Power sup
Used SMT Equipment | Pick and Place/Feeders
Yamaha YG100R high speed chip High precision and high speed modular mounter High resolution digital multi vision camera with high performance servo system based on high rigidity and dual drive Original multi precision correction system multi la
Industry News | 2017-06-14 10:46:29.0
GPD Global offers uniquely designed 2-part mixing pump to accurately mix and dispense two-part components while eliminating entrapped air.
Industry News | 2003-06-09 08:37:23.0
his figure does not include additional revenues from shipments against orders booked in prior periods.
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Parts & Supplies | SMT Equipment
E3007700000 OUTER SP HOLDER E3007715000 HEAD UPPER BLOCK E30077150A0 HEAD UPPER BLOCK ASM. E3007721000 Z SLIDE BRACKET HD E3007723000 Y-AXIS COVER E3007729000 Z STOPPER E3007750000 BU BRACKET E30077500A0 BU BRACKET ASM. E3007760000 P
Parts & Supplies | Pick and Place/Feeders
THK head slider 2RSR9ZMUU+175LM for JUKI Other juki parts: E3007721000 Z SLIDE BRACKET HD E3007723000 Y-AXIS COVER E3007729000 Z STOPPER E3007750000 BU BRACKET E30077500A0 BU BRACKET ASM. E3007760000 PCB HOLDING BASE SENSOR E3007802000 SHAFT
Technical Library | 2021-12-31 01:27:08.0
A servomotor refers to the actuator to control the operation of mechanical components in the servo system and is a subsidy motor indirect transmission device. The servo motor can control speed, whose position accuracy is high, and convert voltage signal into torque and speed to drive the controlled object. A servomotor speed is controlled by the input signal, responding quickly.
Technical Library | 2020-09-23 21:37:25.0
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which has a melting point of about 139°C. Experience so far indicates that such Bi-Sn alloys do not have the mechanical properties and microstructural stability necessary to deliver the reliability required for the mounting of BGA packages. Options for improving mechanical properties with alloying additions that do not also push the process temperature back over 200°C are limited. An alternative approach that maintains a low process temperature is to form a hybrid joint with a conventional solder ball reflowed with a Bi-Sn alloy paste. During reflow there is mixing of the ball and paste alloys but it has been found that to achieve the best reliability a proportion of the ball alloy has to be retained in the joint, particular in the part of the joint that is subjected to maximum shear stress in service, which is usually the area near the component side. The challenge is then to find a reproducible method for controlling the fraction of the joint thickness that remains as the original solder ball alloy. Empirical evidence indicates that for a particular combination of ball and paste alloys and reflow temperature the extent to which the ball alloy is consumed by mixing with the paste alloy is dependent on the volume of paste deposited on the pad. If this promising method of achieving lower process temperatures is to be implemented in mass production without compromising reliability it would be necessary to have a method of ensuring the optimum proportion of ball alloy left in the joint after reflow can be consistently maintained. In this paper the author explains how the volume of low melting point alloy paste that delivers the optimum proportion of retained ball alloy for a particular reflow temperature can be determined by reference to the phase diagrams of the ball and paste alloys. The example presented is based on the equilibrium phase diagram of the binary Bi-Sn system but the method could be applied to any combination of ball and paste alloys for which at least a partial phase diagram is available or could be easily determined.
Semi automatic type; all sizes available www.jwide-smt.com sales@jwide-smt.com
Semi automatic type; all sizes available www.jwide-smt.com sales@jwide-smt.com
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
ENERGY1 - TECHNICAL CONSULTANT FOR POWER , UTILITIES AND MANUFACTURING
Events Calendar | Tue Sep 08 00:00:00 EDT 2020 - Tue Sep 08 00:00:00 EDT 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
Career Center | , Massachusetts USA | Sales/Marketing
Defense Electronics Business Development Manager needed to help develop new business opportunities as well as maintain existing business throughout the Northeast. The successful candidate will be responsible for providing business development supp
Career Center | Rocklin, California USA | Production
General Overview of Position With this new position Parallax aims to improve our USA manufacturing throughput in a time when most companies normally only send work offshore. This raises the standard for requiring efficient use of our Pick and Place
Career Center | Torrington, Connecticut | Engineering,Management,Production,Quality Control,Sales/Marketing,Technical Support
MECHANICAL AND ELECTRONIC CAD TECHNOLOGY-CERTIFICATION • TECHNICAL DRAFTING: Equipment Use, Orthographic Projection, Dimensioning, Auxiliary Views, Fasteners, Manufacturing Processes and Fits and Tolerances • POWER TRANSMISSION/ANSI 14.5 1994: Bearin
Career Center | Alton, Missouri USA | Sales/Marketing
20+ years experience in the southern Illinois and eastern Missouri territory. Have worked with all the manufacturers within the territory. Have sold numerious products ranging from PCBs to microprocessors.
GPD Global | https://www.gpd-global.com/co_website/pdf/pbt/Wafer-Option-PBFT-SPC98-PBT-3029.pdf
parts and the Wafer Option. Disassemble PBFT All “Item” reference numbers used in the following procedure refer to parts shown on Drawing PBFT-3D2 in the PBFT VS SPC 98 User Guide (Part No. PBT-002C
ORION Industries | http://orionindustries.com/downloads.php
® 3M Adhesive Product Summary Chart 3M 200 MP Adhesives 3M 300 MP Adhesives Formex ® / Statex ® Reference Chart Lexan® FR 700 Specification Lexan® FR 60 Specs Lexan®
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