Industry News: reflow and zcr and 4

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

New AT-GDP Series BGA Rework Station Provides the Latest Precision and Process Control

Industry News | 2009-09-23 21:53:53.0

Advanced Techniques US (ATCO)announces the development of an AT-GDP Series BGA Rework Station. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. This model handles both leaded and lead-free applications consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s.

Advanced Techniques US Inc. (ATCO)

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