Managing the Ultimate Reflow Oven Output. The KIC RPI helps manage reflow ovens to consistently maximize the desired results. In addition, the RPI provides process deficiency information in order to help users correct their defect issues quickly. T
New Equipment | Rework & Repair Equipment
Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,
Electronics Forum | Thu Nov 11 19:07:39 EST 1999 | Gary Kemp
We are having a continuing problem with 0603 chip capacitors not centering themselves on the pads during the reflow process, causing an open condition at one end. Does anyone know what can be done to alleviate this? Thanks much. Gary
Electronics Forum | Tue Feb 04 18:46:01 EST 2003 | slthomas
"Use the pad mating to lead wetting area." If I get your drift, we're talking about the minimum lead area (assuming the pad has an area that's at least as large as the lead) required to be wetted by IPC-610. Hmmmm...that would take some calculation
Industry News | 2018-10-18 09:14:05.0
Lead-free processes propose new requirements on reflow soldering quality
Industry News | 2015-03-16 18:27:21.0
KIC today announced that it will exhibit in Stand B-1D40 at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will demonstrate the Footprint, ProBot, X5, K2 and Mobile Profile Viewer APP.
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
There is SPI for Screen Printing. AOI for Pick and Place. Now there is RPI (Reflow Process Inspection) for the Reflow Oven. KIC's RPI provides production reports such as yield analysis, DPMO, Pareto Charts, Cpk and much much more. When RPI is use
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
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KIC X5 Thermal Profiler With SPC Software And RF Capability For Reflow Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic417&OB=DESC.html
. Also, not having a side goal aligns the package straight on the pads. If you add a side goal, the Molded Body part can drift during reflow and come out of the oven at an angle
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