New SMT Equipment: relief copper (1)

GE BENTLY NEVADA 134652-01 PLC TRANSIENT DATA INTERFACE TDXNET

GE BENTLY NEVADA 134652-01 PLC TRANSIENT DATA INTERFACE TDXNET

New Equipment | Industrial Automation

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XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: relief copper (38)

Thermal relief question

Electronics Forum | Sat Jun 11 07:51:15 EDT 2016 | davef

Hi Steve ... There are arguments between fabricators and thermal relievers about adding non-connected copper tabs to barrels in hopes of providing thermal relief, but that's not what you're talking about, I believe. I don't foresee an issue moving t

Thermal relief question

Electronics Forum | Wed Jun 08 17:35:04 EDT 2016 | slthomas

We all know that whenever possible, we want thermal relief between the barrel/pad and the copper foil to make it easier to properly solder that through hole connector. My question is, assuming there is no connection from the barrel to a copper layer

Industry News: relief copper (5)

IPC Members Meet with EPA on Proposed Changes to DSW Rule Advocate for Rule that Encourages Recycling of Secondary Materials

Industry News | 2012-06-13 08:49:05.0

On Tuesday, June 5, 2012, leaders of IPC’s Environment, Health and Safety (EHS) Committee met with senior U.S. Environmental Protection Agency (EPA) staff to discuss regulatory relief for printed board manufacturing.

Association Connecting Electronics Industries (IPC)

How to Prevent Short Circuits to Ground in QFN Components?

Industry News | 2018-10-18 08:29:16.0

How to Prevent Short Circuits to Ground in QFN Components?

Flason Electronic Co.,limited

Technical Library: relief copper (1)

Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components

Technical Library | 2022-08-08 15:06:06.0

Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.

Hentec Industries, Inc. (RPS Automation)

Express Newsletter: relief copper (153)

Partner Websites: relief copper (50)

Soldering Thick PCB's With 3 oz Copper - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-thick-pcbs-with-3-oz-copper

. Make sure there are heat relief areas where the copper layers intersect with the plated through hole. This will prevent the thick copper layers pulling the heat away from the plated through hole. Flux

PCB Fabrication Tolerances | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/tolerances/

. They provide enough variation for us to manufacture your board – and for it to work properly in your application. Copper to Edge of Printed Circuit Board Minimum of 0.007″ (outer layers) and 0.015″ for inner layers (0.020

Imagineering, Inc.


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