Electronics Forum | Thu Jun 07 05:11:42 EDT 2012 | cp38260
Hi, I have pcbs (Duroid/RT 5880) with raw copper, soldered in vapour-phase chamber at 230 degrees Celsius. During soldering, copper gets tarnished. Cleaning with Vigon A250 removes the tarnished layer. Indeed, in the VigonA250 techn. datasheet it is
Electronics Forum | Fri Apr 16 11:03:35 EDT 2004 | davef
Your copper corrosion is not good. It indicates that you have not done a good job in cleaning. [We assume this is a medium green color, not unlike the color of the solder mask on your board, that is almost like a translucent lacquer; rather than th
Electronics Forum | Thu Aug 06 19:20:09 EDT 2009 | boloxis
easy, just dip the ICs on a very weak solution of Nitric Acid, by very weak I mean like drops of Fuming Nitric acid in a half full DI water beaker. Place the beaker on a Ultrasonic bath and dip/shake the ICs in the solution in 5~ 10 seconds only. You
Electronics Forum | Tue Sep 11 22:52:18 EDT 2007 | davef
Here are some options for removing OSP coatings from pads of the BGA substrates. * Leave the substrates in storage for 13-14 months. Shelf life of OSP coating is ~12 months, depending on the product. * Wash the substrates in your aqueous washer. Ea
Electronics Forum | Thu Jan 29 09:18:36 EST 2015 | davef
Nichrome, manganin, phosphor bronze etc are easy to solder ... the hard part is removing the corrosion * Manganin: 86% copper, 12% manganese, 2% nickel. Often, it's used in making cryogenic measurements, due to its low heat loss. * Select a flux for
Electronics Forum | Tue Jan 26 09:33:24 EST 2010 | smt_guy
Hi, I have a copper plate that we received from supplier with oils and some sort of stains. We tried most of the general type of degreasers by soaking but didn't work until we tried a Floor Stripper from Ace and it does make the copper clean and shi
Electronics Forum | Fri Feb 25 18:13:17 EST 2005 | davef
Your leadfree dross should float, similar to your leaded dross. It's possible you're thinking about the process for removing excess copper from the solder pot. Following the same process, with: * Leaded solder, the copper floats. So, you scoop the
Electronics Forum | Tue Jan 16 07:17:20 EST 2007 | adamp
I have checked pot temperature in different parts of solder pot and it looks like it is correct (250C). I have also lowered solder pot temperature and removed copper from the surface of the solder pot (operation repeated couple times). There is still
Electronics Forum | Wed Oct 29 22:41:42 EST 2003 | msimkin
Our design team have got a problem. We need to either drill out 6 vias/pads for a BGA site, or remove the solder balls form the BGA before they are palced. ( std eutectic) Has anyone used a vendor to remove balls from BGA (0.75mm piutch, ball size ap
Electronics Forum | Thu Feb 20 07:48:16 EST 2020 | benreben
Hello, The oven profil is not the solution! The only solution for the solder mount on the side is to put gel flux on the side of qfn and make a second travel in reflow . The flux remove oxyde from the copper that is not tinned and the solder is able
